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A kind of resin bond type diamond grinding pad and preparation method thereof

A diamond and bond technology, which is used in grinding tools, metal processing equipment, grinding/polishing equipment, etc., can solve the problem that diamond grinding pads cannot be used for roughing and finishing at the same time, and is beneficial to product yield and improvement. The effect of deformation and demoulding to remove particle problems and eliminate void problems

Active Publication Date: 2017-10-17
LENS TECH CHANGSHA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a resin bonded diamond grinding pad to solve the technical problem that the diamond grinding pad of the same component cannot be used for rough and finish machining at the same time

Method used

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  • A kind of resin bond type diamond grinding pad and preparation method thereof
  • A kind of resin bond type diamond grinding pad and preparation method thereof
  • A kind of resin bond type diamond grinding pad and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] 1) Mixing: take each raw material by mass percentage, resin bond 35%, diamond 10%, wollastonite 50%, molybdenum disulfide 3%, fumed silica 2%, wherein E material needs to be sieved, wherein , The average particle size of diamond is 30μm; the average particle size of wollastonite is 30μm; the average particle size of molybdenum disulfide is 10μm; the average particle size of fumed silica is 100nm. Pour the weighed raw materials into the material cup at one time, and use a vacuum planetary mixer to stir evenly for 6 minutes, and the speed of the mixer is 400rpm / 2min, 500rpm / 2min, 600rpm / 2min.

[0054] The resin binder includes 59% epoxy resin, 40% acid anhydride curing agent and 1% accelerator.

[0055] 2) Pouring: Fill the uniformly mixed raw materials obtained in 1) into the square groove at the bottom of the silicone rubber mold of the abrasive pad, and after the surface is smoothed, put it into a vacuum defoaming machine for 3 times, 30 minutes each time, The vacuum ...

Embodiment 2

[0062] 1) Mixing: take each raw material by mass percentage, resin bond 47%, diamond 15%, wollastonite 34%, molybdenum disulfide 3%, fumed silica 1%, wherein E material needs to be sieved, wherein , The average particle size of diamond is 30μm; the average particle size of wollastonite is 30μm; the average particle size of molybdenum disulfide is 10μm; the average particle size of fumed silica is 100nm. Pour the weighed raw materials into the material cup at one time, and use a vacuum planetary mixer to stir evenly for 6 minutes, and the speed of the mixer is 400rpm / 4min, 500rpm / 4min, 600rpm / 4min.

[0063] The resin binder includes 44% epoxy resin, 55% acid anhydride curing agent and 1% accelerator.

[0064] 2) Pouring: Fill the uniformly mixed raw materials obtained in 1) into the square groove at the bottom of the silicone rubber mold of the abrasive pad, and after the surface is smoothed, put it into a vacuum defoaming machine for 3 times, 30 minutes each time, The vacuum ...

Embodiment 3

[0071] 1) Mixing: take each raw material by mass percentage, resin bond 47%, diamond 5%, wollastonite 39%, molybdenum disulfide 8%, fumed silica 1%, wherein E material needs to be sieved, wherein , The average particle size of diamond is 20μm; the average particle size of wollastonite is 15μm; the average particle size of molybdenum disulfide is 10μm; the average particle size of fumed silica is 100nm. Pour the weighed raw materials into the material cup at one time, and use a vacuum planetary mixer to stir evenly for 6 minutes, and the speed of the mixer is 400rpm / 2min, 500rpm / 3min, 600rpm / 4min.

[0072] The resin binder includes 50% epoxy resin, 49% acid anhydride curing agent and 1% accelerator.

[0073] 2) Pouring: Fill the uniformly mixed raw materials obtained in 1) into the square groove at the bottom of the silicone rubber mold of the abrasive pad, and after the surface is smoothed, put it into a vacuum defoaming machine for 3 times, 30 minutes each time, The vacuum v...

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Abstract

The invention provides a resin bonding agent type diamond grinding pad and manufacturing method thereof. The grinding pad sequentially comprises a PC board layer with glue attached to the two faces, a PET film layer, a non-woven fabric layer, a binding agent layer and a diamond layer from bottom to top. The diamond layer comprises, by mass, the component raw materials of 35 percent to 50 percent of resin bonding agents, five percent to 15 percent of diamonds, 30 percent to 50 percent of wollastonite, three percent to eight percent of molybdenum disulfide and 0.5 percent to 2.5 percent of fumed silica. The resin bonding agent type diamond grinding pad is stable in performance, good in cutting force and long in service life, rough processing and finish processing of an optical lens can be combined into one through the grinding pad, cutting efficiency and precision are high, the surface quality of a processed product is improved, and the yield is increased.

Description

technical field [0001] The invention relates to the technical field of rough and fine grinding of optical lenses, in particular to a resin bond type diamond grinding pad and a preparation method thereof. Background technique [0002] At present, most domestic optical glass processing enterprises adopt the traditional free grinding process, that is, adding grinding powder to the cutting fluid, and the grinding powder flows into the grinding disc with the cutting fluid (the upper and lower discs of the grinding disc are both iron discs), It achieves the effect of grinding; the stability of the cutting force of this process is poor, resulting in low cutting efficiency; the yield rate of processed products is low, and the surface finish is poor; and the service life of the grinding powder is short, and it cannot be separated and recycled, resulting in a large amount and difficult to clean. It is easy to pollute the environment. [0003] When the fixed abrasive is used for grind...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/22B24B37/24B24D18/00
CPCB24B37/22B24B37/24B24D18/00B24D18/0009
Inventor 周群飞饶桥兵康萌
Owner LENS TECH CHANGSHA
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