Thin film arranged on substrate and preparation method of thin film
A substrate and thin-film technology, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve the problems of difficult to obtain thin films, high heating temperature, and difficult to prepare thin films, so as to improve machinability, excellent performance, and film thick and even effect
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[0038] The present invention also includes a method for preparing a thin film disposed on a substrate, comprising the following steps:
[0039] (1) Take two identical original substrates, namely the first original substrate and the second original substrate, and use ion implantation to treat the first original substrate, and implant ions into the first original substrate, so that the first original substrate is removed from the It is divided into a thin film layer, a separation layer and a residual layer from top to bottom, and the implanted ions are distributed in the separation layer; a layer of inorganic silicon material is deposited on the second original substrate to obtain the original substrate layer and a sacrificial layer; the inorganic silicon material It is one of silicon dioxide, polysilicon or silicon nitride; the ions are hydrogen ions or helium ions;
[0040] (2) Bond the first original substrate and the second original substrate processed in step (1) by wafer ...
Embodiment 1
[0059] The lithium niobate thin film arranged on the silicon substrate, the thickness of the lithium niobate thin film is 10 nanometers.
[0060] The preparation method of the lithium niobate film that is arranged on the silicon substrate comprises the following steps:
[0061] (1) Provide two original substrates of lithium niobate, which are the first original substrate and the second original substrate. The first original substrate is treated by ion implantation, and helium ions are implanted into the first original substrate. The energy of helium ion implantation is 500 keV, the dose is 5×10 16 ions / cm 2, so that the first original substrate is divided into thin film layer, separation layer and residual layer from top to bottom, implanted helium ions are distributed in the separation layer; on the second original substrate, it is deposited by plasma enhanced chemical vapor deposition (PECVD) A layer of loose silicon dioxide with a thickness of 2.2 μm, where the power is 2...
Embodiment 2
[0067] Lithium tantalate film on a silicon substrate. The thickness of lithium tantalate film is 30×10 3 Nano.
[0068] The preparation method of the lithium tantalate thin film arranged on the silicon substrate comprises the following steps:
[0069] (1) Provide two original substrates of lithium tantalate, which are the first original substrate and the second original substrate. The first original substrate is treated by ion implantation, and hydrogen ions are implanted into the first original substrate. The hydrogen ion implantation energy is 2500keV, the dose is 7×10 17 ions / cm 2 , so that the first original substrate is divided into a thin film layer, a separation layer, and a residual layer from top to bottom, and hydrogen ions are injected to distribute in the separation layer; a layer of polysilicon material with a thickness of 3 μm is deposited on the second original substrate by PECVD , where the power is 250W, the pressure is 500 mTorr, and the temperature is 25...
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