Method for preparing high-efficiency micro heat tube by combining copper powder with copper oxide powder

Abstract

The invention discloses a method for preparing a high-efficiency micro heat tube by combining copper powder with copper oxide powder. An evaporation section and a condensation section of the heat tube respectively consist of sintered coppers with different porosities, wherein the evaporation section is formed by sintering micron-sized copper powder, and the porosity is within 40-50%; and the condensation section and a thermal insulating section consist of high-porosity sintered coppers mixed, reduced and sintered by millimeter-sized, micron-sized or nanometer-sized copper oxide powder or copper oxide powder with different particle sizes, and the porosity reaches 60-85%. The low porosity and the small aperture of the evaporation section are convenient to quickly vaporize a liquid-phase medium; and the condensation section and the thermal insulating section use the high-porosity sintered coppers as liquid absorbing cores, so that the liquid-phase reflowing heat resistance is low, liquid quickly flows back to the evaporation section, and the phase change circulation is accelerated. The method respectively injects the needed weights of the copper powder and the oxide copper powder through calculation according to the design requirements of the heat tube to produce the heat tube with different porosities and composite structure; the radiating efficiency is greatly improved, the heat resistance is low, and the quick high-efficiency radiating effect is achieved. The method is easy in operation, simple in equipment, low in production cost and suitable for industrialized production.

Description

technical field [0001] The invention relates to a preparation method of a micro-heat pipe for electronic components, which is used for rapid heat dissipation of semiconductor electronic devices, and particularly relates to a method of compounding copper powder and copper oxide powder and then performing high-temperature reduction and sintering to manufacture different parts of the same heat pipe with different porosity A method of sintering copper microheat pipes for liquid wicks. Background technique [0002] Thermal management is especially important for semiconductors and electronic devices and equipment, because effective thermal control of the operating temperature of semiconductors and electronic equipment can ensure the stability and reliability of their work. With the increasing degree of electrical integration, the packaging integration density of semiconductor electronic components has increased rapidly, the chip size has been continuously reduced and the power den...

AI Technical Summary

Problems solved by technology

[0008] The present invention aims at direct sintering of micron-level copper powder as a liquid-absorbing core at present, and the existence of low porosity in the condensing section and the adiabatic section except the evaporating section affects the phase change cycle speed of the liquid medium and the liquid return resistance in the condensing section and the adiabatic section, and proposes to use The composite structure of copper powder and copper oxide powder is used to prepare the liquid-absorbing core micro heat pipe with a composite structure of sintered copper with a relatively low porosity made of conventional sintered copper powder in the evaporator section and high-porosity sintered copper made of reduced sintered copper oxide powder.

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