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Conductive paste composition

A technology of conductivity and composition, applied in conductive coatings, circuits, capacitors, etc., to achieve the effect of inhibiting the erosiveness of the chip

Active Publication Date: 2015-07-08
NORITAKE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned terpineol has strong solubility in butyral-based resins or acrylic resins, so it is difficult to say that it is suitable for the conductive paste composition used to form the internal electrode layer 30 of MLCC10.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0087] [Preparation of conductive paste composition]

[0088] Prepare the conductive paste composition (sample 1-8) according to the following procedure

[0089] That is, first, ethylcellulose (EC) as a binder and isobornyl acetate (IBA) as a main solvent were mixed and stirred at 70° C. for 24 hours to prepare a carrier. Next, conductive powder, additives, and auxiliary solvents were added to the carrier, and sufficiently kneaded by a three-roll mill to obtain conductive paste compositions (samples 1 to 8). It should be noted that, as an auxiliary solvent, the solvents of the combinations shown in the following Table 2 are mixed so that the main solvent: auxiliary solvent is 70:30 in terms of mass ratio, and the viscosity of the conductive paste composition is 0.1 to 3 Pa·s In the range. In addition, the Hansen solubility parameter (HSP) of each auxiliary solvent is shown in Table 2 below.

[0090] In addition, as an additive, barium titanate (BaTiO 3 ) powder. The condu...

Embodiment approach 2

[0112] Both the main solvent and the auxiliary solvent of the organic solvent were changed to prepare a conductive paste composition (sample 9). That is, as shown in the following Table 3, the main solvent uses (c) dihydroterpineyl propionate with a smaller HSP to replace (d) isobornyl acetate, and the auxiliary solvent uses a solvent with HSP slightly larger than (d) isobornyl acetate. (e) Dihydroterpineol, the latter is carried out similarly to the case of the said Embodiment 1, and the electroconductive paste composition is prepared.

[0113] The conductive paste composition of Sample 9 and the conductive paste composition of Sample 2 prepared in Embodiment 1 were applied to the surface of the same ceramic green sheet as in Embodiment 1 by the gravure printing method, and dried. , thereby forming an electrode film (electrode pattern). For the electrode pattern formed using the plate making different from Embodiment 1 in this gravure printing, it carried out similarly to Em...

Embodiment approach 3

[0120] As ceramic green sheets, the same ceramic green sheets as those in Embodiment 1 and ceramic green sheets using acrylic resin as a binder were prepared, and the conductive surface of sample 2 produced in Embodiment 1 was coated on the surface of these green sheets by the gravure printing method. The paste composition is formed and dried to form an electrode film (electrode pattern). A plate making different from Embodiments 1 and 2 is used in this gravure printing. About the formed electrode pattern, it carried out similarly to Embodiment 1, and evaluated the printability and sheet erosion property. The evaluation results are shown in Table 4 below.

[0121] [Table 4]

[0122] Table 4

[0123]

[0124] As shown in Table 4, the conductive paste composition of Sample 2 has both good printability and sheet erosion properties, and it can be confirmed that it is suitable for various plate making and ceramic green sheets using acrylic and butyral resins. Either one is o...

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Abstract

The invention set forth herein provides a conductive paste composition that suppresses chemical attack, even in extremely thin ceramic green sheets, and enables high printing precision to be achieved. The conductive paste composition includes a conductive powder, a binder, and an organic solvent. The organic solvent contains isobornyl acetate as a primary solvent, and a solvent having a Hansen solubility parameter lower than that of isobornyl acetate as a secondary solvent.

Description

technical field [0001] The present invention relates to a conductive paste composition. More specifically, it relates to a conductive paste composition that can be suitably used for forming internal electrodes of laminated ceramic electronic components. [0002] In addition, this application claims the priority based on the JP Patent application 2012-244846 for which it applied on November 6, 2012, The content of this application is taken in as a reference in this specification. Background technique [0003] Along with the miniaturization and high integration of electronic equipment in recent years, the miniaturization of the structure has been promoted to be incorporated in electronic components of electronic equipment. For example, in electronic components such as multilayer capacitors and multilayer ceramic wiring boards, further miniaturization and thinning are required. [0004] figure 1 It is a figure explaining the structure of a multilayer ceramic capacitor (Herei...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/00C08K3/00C08K5/00H01B1/20H01B1/22H05K1/09H01B13/00
CPCC08K3/08H05K1/092H01G4/30H01G4/008H01G4/00C08L101/00H01B1/22C09D5/24C09D7/20
Inventor 平尾和久稻冈康二高田重治内藤宏之
Owner NORITAKE CO LTD
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