Detinning and degumming equipment for printed circuit boards and electronic elements and method of detinning and degumming equipment

Abstract

The invention relates to auxiliary equipment used in repair of printed circuit boards (PCBs) and electronic elements, in particular to detinning and degumming equipment for the printed circuit boards and the electronic elements as well as a use method of the detinning and degumming equipment. According to the equipment, manual operation is directly replaced and accurate motion control is adopted, so that the repair processing quality of a product is greatly improved; accurate temperature control is adopted, so that the elements are prevented from being overheated and the product safety is guaranteed; vacuum adsorption is adopted during detinning and a suction nozzle is not contacted with a workpiece, so that a welding plate is prevented from falling off; the combination of a complete system enables the whole processing batch quality to be unified; the equipment is suitable for repair of PCBs and BGA (ball grid array) elements of various electronic products from low end to high end. A tin suction pipe heater assembly is further arranged at an upper part of a detinning and degumming head, so that after tin or gum is sucked, blockage of a pipeline caused by re-solidification of tin due to cooling is prevented; the heating temperature is higher than the melting point of tin, so that tin is always in a molten state. A man-machine interaction module is connected with the equipment, so that man-machine interface operation is realized and the equipment is started for automatic operation after parameter setting.

Description

[0001] technical field [0002] The invention relates to auxiliary equipment used in the maintenance of printed circuit boards and electronic components, in particular to a device for removing tin and glue from printed circuit boards and electronic components and a method for using the device. Background technique [0003] For example, the publication number is CN1214610A patent, the application date is 1998.9.29, a composition and method for removing tin and solder on the copper substrate of a printed circuit board and the tin-copper alloy under it. An aqueous solution of nitric acid to dissolve tin and solder, a source of iron ions in an amount sufficient to dissolve the tin-copper alloy, a source of halide ions in an amount sufficient to significantly increase the resistance between printed circuits go through a series of dissolving tin, solder, copper alloys, etc. on the circuit board, To achieve the purpose of removing tin, solder, copper alloy, etc. on the circuit ...

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Problems solved by technology

[0004] 1. Use nitric acid aqueous solution, nitric acid is a strong acid, and it is liquid, it is extremely corrosive, and has certain safety hazards for personnel operation;

[0005] 2. The iron ion source and the resistance halogen ion source are disposable consumables, which have no other function after reaction and waste resources;

[0006] 3. The equipment that can withstand the above-mentioned acid liquid must be acid-resistant;

[0008] 5. The effect of removing tin, solder, and copper alloy is poor, and the scrap rate of circuit boards is high

[0009] With the continuous development of science and technology, the current SMT surface mount technology industry adopts the method of heating and melting the solder pads with a soldering iron when renovating and soldering invalid PCB and BGA components, and then cooperates with the tin-absorbing tape to manually remove the surface of the workpiece. Residual tin removal; this traditional method is subject to manual operation, which may cause surface and invisible problems such as overheating of the pad, internal wiring of the component, uneven repair quality, peeling off of the pad, and shortened life of the high-temperature impact of the part. Traditional refurbishment methods have been afraid to use on high-end electronic products, and can only be scrapped directly, resulting in great waste

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