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Heat conductive phase-change material and production method thereof

A technology of phase change material and production method, which is applied in the direction of heat exchange materials, chemical instruments and methods, etc., to achieve the effects of strong practicability, low equipment investment cost and simple operation

Inactive Publication Date: 2015-05-27
PINGHU ALLIED IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a thermally conductive phase change material and its production method to solve the defects existing in the existing thermally conductive phase change materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A thermally conductive phase change material is composed of the following components by weight percentage: 84% of thermally conductive filler, 5% of low-melting solid resin, 10% of liquid resin, 0.5% of antioxidant, and 0.5% of coupling agent.

[0023] The thermally conductive filler is a mixture of aluminum oxide, boron nitride, zinc oxide, and aluminum powder, and the weight percentage of the aluminum oxide, boron nitride, zinc oxide, and aluminum powder is 5:1:1:3, and the thermally conductive filler The particle size of the low melting point solid resin is not more than 20 μm, the low melting point solid resin is microcrystalline wax, the melting point of the low melting point solid resin is 70° C., the liquid resin is liquid at room temperature, and the liquid resin is polybutadiene , A mixture of polyisoprene, the weight percentage of polybutadiene and polyisoprene is 2:1, and the antioxidant is 2,2-methylenebis(4-methyl-6-tert-butyl Base phenol), the coupling agent ...

Embodiment 2

[0030] A thermally conductive phase change material is composed of the following components by weight percentage: 77% of thermally conductive filler, 7% of low-melting solid resin, 14% of liquid resin, 0.75% of antioxidant, and 1.25% of coupling agent.

[0031] The thermally conductive filler is a mixture of zinc oxide, aluminum nitride, and silver powder, the weight percentage of the zinc oxide, aluminum nitride, and silver powder is 2:3:1, and the low melting point solid resin is a mixture of paraffin wax and microcrystalline wax , The weight percentage of the paraffin wax and the microcrystalline wax is 2:1, the liquid resin is a mixture of polyisoprene and hydroxyl-terminated polyisoprene, and the polyisoprene and hydroxyl-terminated polyisoprene The weight percentage of diene is 3:1, the antioxidant is tetraphenyldipropylene glycol diphosphite, and the coupling agent is isopropyl triisostearate titanate and isopropyl tris(dioctyl A mixture of pyrophosphate acyloxy) titanate,...

Embodiment 3

[0038] A thermally conductive phase change material is composed of the following components by weight percentage: 88% of thermally conductive filler, 3% of low melting point solid resin, 7% of liquid resin, 0.25% of antioxidant, and 1.75% of coupling agent.

[0039] The thermally conductive filler is a mixture of zinc oxide, aluminum powder, and graphite, the weight percentage of the zinc oxide, aluminum powder, and graphite is 2:3:1, and the low melting point solid resin is a mixture of microcrystalline wax and silicon wax, The weight percentage of the microcrystalline wax and silicon wax is 1:2, the liquid resin is a mixture of hydroxy-terminated polybutadiene and hydroxy-terminated polybutadiene acrylonitrile, and the hydroxy-terminated polybutadiene and hydroxy-terminated polybutadiene The weight percentage of polybutadiene acrylonitrile is 1:1, and the antioxidant is tetrakis (β-(3,5-tertiary butyl-4-hydroxyphenyl) propionic acid) pentaerythritol ester and tetraphenyl dipropy...

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PUM

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Abstract

The invention relates to a heat conductive phase-change material which consists of the following components in percentage by weight: 75-90% of heat conductive filler, 2-8% of low-melting-point solid resin, 5-15% of liquid resin, 0.01-1% of an antioxidant and 0.02-2% of a coupling agent, and the phase-change material is prepared through a production method of mixing raw materials, mixing the heat conductive filler, pressing and forming, and cooling. The heat conductive phase-change material, which is prepared by mixing the heat conductive filler, the low-melting-point solid resin, the liquid resin, the antioxidant and the coupling agent, disclosed by the invention has the advantages that the phase-change material is in a shape of flaky solid at room temperature, so that the material is convenient in using and operation and can be directly attached on the surface of a heat-radiating component; when the component runs to the working temperature of the heat conductive phase-change material, phase change occurs and the material becomes soft, so as to wet the surface of the component to a great extent, and contact thermal resistance is reduced to the lowest so as to guarantee a heat conductive interstitial property better than that of heat conductive grease or a graphite flake; in addition, with excellent thixotropy, the material, when being used in a vertical direction, is protected away from circumstance of overflow or flowing.

Description

Technical field [0001] The invention relates to a thermally conductive phase change material and a production method thereof. Background technique [0002] Nowadays, the thermally conductive materials used in the commonly used thermal interface design are mainly paste-like thermal grease, thermally conductive gaskets or graphite sheets and other thermally conductive materials. When used, they are placed between the heating and radiator components, mainly through heat conduction. The mechanism transfers the generated heat to the radiator to dissipate it. However, the above-mentioned thermally conductive materials often have different disadvantages. For example, under the effect of temperature cycles, paste-like thermally conductive grease products will gradually overflow, commonly known as "oil leakage", which leads to reduced reliability of thermally conductive materials and short circuits between devices. Risk; and the thermal pad cannot be applied to thinner gaps due to the li...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/06
CPCC09K5/063
Inventor 范勇
Owner PINGHU ALLIED IND
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