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Preparation method of flexible super-hydrophobic and super-oleophobic structure

A super-hydrophobic, super-oleophobic, flexible technology, applied in the direction of microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve the problems of difficult process, complicated process, and non-flexible structure, etc., and achieve low process cost , The process is simple and the effect of wide application value

Inactive Publication Date: 2015-05-20
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] while preparing figure 1 The structure shown in (c) has a very complicated process in the prior art, and requires the use of photolithography, inductively coupled plasma etching, wet silicon etching, thermal silicon oxide coating and other processes, and the equipment used is very expensive. The cost is high, the process is difficult, and the structure prepared by the above method is not flexible, which brings a bottleneck to the general utilization of the structure. Therefore, it is urgent to develop a flexible super-hydrophobic and super-oleophobic structure with low cost and simple process. Structural process method

Method used

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  • Preparation method of flexible super-hydrophobic and super-oleophobic structure
  • Preparation method of flexible super-hydrophobic and super-oleophobic structure
  • Preparation method of flexible super-hydrophobic and super-oleophobic structure

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Embodiment 1

[0036] (1) Expose the underlying photoresist: Spin-coat a layer of SU-82000 photoresist on the substrate with a thickness of 5 μm, and expose without a mask;

[0037] (2) The first exposure of the structural layer photoresist: spin-coat one deck of SU-82000 photoresist on the exposed SU-82000 photoresist in step (1), with a thickness of 10 μm for exposure; Such as image 3 The array pattern mask shown, wherein the diameter of the inner circle is 3 μm, the diameter of the outermost ring of the outer ring is 10 μm, the width of the ring is 0.5 μm, and the center-to-center distance between the array patterns is 15 μm;

[0038](3) The second exposure of the photoresist of the structural layer: use the mask of the light-transmitting circular array corresponding to step (2) for overlay exposure, and use a small exposure dose so that only the photoresist of the surface layer is 1 μm The cross-linking reaction will not be developed; the light-transmitting circle is consistent with th...

Embodiment 2

[0043] (1) Expose the underlying photoresist: spin-coat a layer of NR26-25000P on the substrate with a thickness of 10 μm, and expose without a mask;

[0044] (2) The first exposure of the structural layer photoresist: spin-coat one deck of SU-8GM 1070 on the exposed SU-8GM 1070 in step (1), the thickness is 12 μm, and expose; image 3 The array pattern mask shown, wherein the diameter of the inner circle is 6 μm, the diameter of the outer ring is 10 μm, the width of the ring is 0.8 μm, and the center-to-center distance between the array patterns is 30 μm;

[0045] (3) The second exposure of the photoresist of the structural layer: use the mask of the light-transmitting circular array corresponding to step (2) for overlay exposure, and use a small exposure dose so that only the photoresist of the surface layer is 1.5 μm The cross-linking reaction of the glue will not be developed; the light-transmitting circle is consistent with the distribution of the mask pattern used in ste...

Embodiment 3

[0050] (1) Expose the underlying photoresist: Spin-coat a layer of NR26-25000P photoresist on the substrate with a thickness of 20 μm, and expose without a mask;

[0051] (2) The first exposure of the photoresist of the structural layer: spin-coat one deck of NR26-25000P photoresist on the NR26-25000P photoresist after exposure in step (1), the thickness is 18 μm, and expose; Such as image 3 The array pattern mask shown, wherein the diameter of the inner circle is 9 μm, the diameter of the outer ring is 20 μm, the width of the ring is 1 μm, and the center-to-center distance between the array patterns is 42 μm;

[0052] (3) The second exposure of the photoresist of the structural layer: use the mask of the light-transmitting circular array corresponding to step (2) for overlay exposure, and use a small exposure dose so that only the photoresist of the surface layer is 2 μm The cross-linking reaction will not be developed; the light-transmitting circle is consistent with the d...

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Abstract

The invention discloses a preparation method of a flexible super-hydrophobic and super-oleophobic structure. The preparation method comprises the following steps of: (1) manufacturing a bottom layer of the flexible super-hydrophobic and super-oleophobic structure: rotatably coating a layer of negative photoresist on a substrate and carrying out exposure without using a mask; (2) rotatably coating a layer of negative photoresist on the negative photoresist after exposure of the step (1), and carrying out exposure by utilizing an array graphic mask; (3) carrying out second-time exposure on the photoresist of a structural layer: adopting the mask corresponding to the step (2) to carry out etching exposure; (4) developing: carrying out development on the structure after exposure in the step; (5) plating a protective layer film: forming a layer of protective film on the surface of the structure obtained in the step (4); (6) peeling: peeling the structure obtained after treatment of the step (5) from the substrate and obtaining the flexible super-hydrophobic and super-oleophobic structure. The preparation method disclosed by the invention is simple in process and low in cost, and has great promotion action for popularization and application of the flexible super-hydrophobic and super-oleophobic structure.

Description

technical field [0001] The invention belongs to the field of micro-nano manufacturing, and more specifically relates to a preparation process of a flexible superhydrophobic and superoleophobic structure. Background technique [0002] Superhydrophobic materials are one of the research hotspots in recent years, and the structures and materials for preparing superhydrophobic surfaces emerge in endlessly. The principle of superhydrophobic materials is mainly to make the liquid in the Cassie-Baxter state on the surface of the microstructure, that is, the liquid surface will be held by the surface microstructure and air without completely touching the solid surface, such as figure 1 As shown, the liquid droplets are suspended on the solid surface microstructure. The surface in the Cassie-Baxter state has superhydrophobic properties, and the rolling angle is small, and the droplets can easily roll off the surface, thus having a self-cleaning effect. Existing superhydrophobic surf...

Claims

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Application Information

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IPC IPC(8): B81C1/00
Inventor 廖广兰谭先华史铁林独莉刘智勇吴悠妮
Owner HUAZHONG UNIV OF SCI & TECH
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