Press-fit type unlocking device and RJ45 port SFP (Small Formfactor Pluggable) module

Abstract

The invention discloses a press-fit type unlocking device and an RJ45 port SFP (Small Formfactor Pluggable) module, and relates to a module for optical communication. The press-fit type unlocking device comprises an RJ45 connector (1), a tilting plate (2), a buckle (3), an RJ45 connector moving cover (6), a rotating shaft (7), a left screwing spring (8) and a right screwing spring (9); a round pin (14) on the RJ45 connector (1) sleeves with a pin hole (33) in the buckle (3) to form a base; a pushing rod cavity (66) in the RJ45 connector moving cover (6) sleeves a pushing rod (21) on the tiling plate (2) to form an RJ45 connector with an unlocking mechanism. Compared with the prior art, the unlocking device has the advantages that the size of the head part of the RJ45 port module can be greatly reduced, and thus the problem of compatibility in high-density inserting and drawing can be solved; the unlocking device and be stable and reliable to act, and the automatic restoring function is achieved; meanwhile, the structure is simplified, the arrangement area of a PCB is increased, and as a result, the stability of the model process is improved, and the cost is reduced.

Description

technical field [0001] The invention relates to a module for optical communication, in particular to a press-fit unlocking device and an SFP module with an RJ45 electric port. Background technique [0002] In data communication and telecommunication communication lines, a large number of SFP modules are used, that is, Small Form-Factor Pluggable (SFP for short) for optical / electrical communication transceivers. It provides the function of bidirectional data transmission in the optical communication system, and its main application fields include SDH (Synchronous Digital Hierarchy, synchronous digital series) add-drop multiplexer, optical edge device and MSPP (modular software programmable processor, modular software programmable processing machine) and switching systems. [0003] The mechanical structure of the SFP optical module is defined in the MSA (MultiSource Agreement, multi-source agreement) or SFF-8432 agreement. The connection between the SPF optical module and th...

AI Technical Summary

Problems solved by technology

[0006] 1. Due to the setting of the RJ45 connector 100 and the unlocking mechanism, the upper shoulder height 108 and the lower shoulder height 107 of the module exceed the maximum 2mm size limit of MSA and SFF-8432, resulting in compatibility issues;

[0007] That is, when the RJ45 electrical port module is installed on a high-port-density switch, it is easy to interfere with the upper and lower modules, resulting in the inability to perform high-density plugging and unplugging, wasting the precious port resources of the switch

[0008] 2. In actual use, the reliability of repeated plugging and unplugging is low, and it is prone to problems that cannot be locked or unlocked

[0009] 3. The unlocking mechanism cannot be automatically reset, and the user experience is low

[0010] 4. The available PCB layout area is small, which cannot meet the layout requirements of PHY chips with a rate greater than 1G

[0013] After zinc alloy die-casting, there are still processes such as blanking, deburring, sandblasting, and electroplating; currently, some of these processes need to be manually operated, which has a great impact on dimensional stability, resulting in low dimensional consistency of SFP package modules , also indirectly lead to problems such as unlocking

[0014] 2) High manufacturing cost

[0015] At present, the yield of zinc alloy shells from die casting to final assembly is low, about 85%.

[0016] 3) Environmental pollution issues

[0017] At present, almost all shells are die-cast with zinc alloy, and electroplating process must be used. If the waste liquid generated in the electroplating process is not handled properly, it will easily cause environmental pollution.

[0018] In short, there are deficiencies in the existing unlocking methods and casings, which directly hinder the application of RJ45 electrical port SFP modules on high-port density and high-speed communication lines, and there is a lack of an unlocking structure and casing that can completely solve these problems

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