Gas medium homogenizer for high power laser diode sintering

Abstract

The invention discloses a gas medium homogenization device for high-power laser diode sintering, which relates to the field of optoelectronic technology. The suction nozzles of the equipment are sealed and matched, and the support is provided with an intake passage and an exhaust passage that communicate with the intake pipe and the exhaust pipe, and the other ends of the intake passage and the exhaust passage communicate with the hollow area in the middle of the support. Install the bracket on the sintering table, so that the heat sink with solder is fixed to the connecting plate in the hollow area, a high-power laser diode is placed on the heat sink with solder, and the suction nozzle of the sintering equipment is adsorbed above the hollow area, reducing the gas Entering from the intake passage, it can fully cover the surface of the solder, which can fully restore the solder in the sintering area of ​​the laser diode chip, and then use the exhaust passage to export the reduced exhaust gas to form a complete circuit. The invention has the advantages of simple structure, homogenization of reducing gas, and improvement of consistency of solder reduction.

Description

technical field [0001] The invention relates to the field of optoelectronic technology. Background technique [0002] High-power semiconductor lasers have been more and more widely used in solid-state laser pumping, laser processing, laser medical treatment, laser display and military applications, especially in solid-state laser pumping applications, due to their small size and light weight, It is favored for its high efficiency and reliability. In the past ten years, with the further maturity of high-power semiconductor laser products, the output power of linear arrays and stacked array modules packaged into laser bars through various structures can reach thousands of watts or even tens of thousands of watts. The demand in the field has grown considerably. [0003] Usually, the semi-automatic sintering equipment used for high-power laser diode sintering uses a suction nozzle to pick up the laser diode chip, and then places it on a heat sink with solder for direct sinteri...

AI Technical Summary

Problems solved by technology

Traditional high-power laser diode sintering and infiltration generally adopts hydrogen reduction sintering infiltration, which can improve sintering infiltration and sintering voids, but there are defects such as cumbersome operation, long time, insufficient reduction, high sintering void rate, and unsafety.

[0004] At present, the solder widely used in high-power laser diode sintering is indium. Although indium oxidizes slowly in the air, the evaporated indium is easily oxidized in the air to form an oxide film (In 2 o 3 ), the oxide film is not easy to infiltrate with the chip during sintering, forming cavities. If the reduction is not sufficient, the residual gas on the surface of the solder will also easily form cavities. The infiltration cavity has the greatest influence on the heat dissipation and power of high-power laser diodes.

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