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Semiconductor process equipment

A technology of process equipment and semiconductor, applied in the direction of metal material coating process, ion implantation plating, coating, etc., to achieve the effect of reducing the end effect, reducing the length, and improving the sputtering rate

Active Publication Date: 2021-02-23
北京七星华创集成电路装备有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the shortcomings of the existing methods, this application proposes a semiconductor process equipment to solve the problem of how to ensure the uniformity of the coating and improve the utilization of the target at the same time rate technical issues

Method used

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  • Semiconductor process equipment
  • Semiconductor process equipment
  • Semiconductor process equipment

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Embodiment Construction

[0028] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0029] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...

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Abstract

The embodiment of the invention provides semiconductor process equipment. The semiconductor process equipment is used for carrying out a rare earth deposition process on a substrate, and comprises anelectrode assembly and an air inlet mechanism which are arranged on the top wall of a process chamber and extend in a first direction; the air inlet mechanism is arranged around the electrode assembly; a moving mechanism is arranged at the bottom in the process chamber, extends in a second direction and is used for bearing and driving the substrate to move in the second direction, and the second direction is intersected with the first direction; and an air extracting mechanism is arranged on the top wall of the process chamber and communicates with the process chamber, the air extracting mechanism is located on one side of the electrode assembly, the air extracting mechanism is provided with an air extracting opening in the process chamber, and the air extracting opening extends in the first direction and is close to the air inlet mechanism and used for enabling process gas in the process chamber to evenly pass through the surface of the substrate. According to the semiconductor process equipment, the sputtering rate of the target material can be greatly improved while the coating uniformity is ensured, so that the production cost is greatly reduced.

Description

technical field [0001] The present application relates to the technical field of semiconductor processing, and in particular, the present application relates to a semiconductor process equipment. Background technique [0002] At present, in the production process of rare earth magnetic materials, it is necessary to use physical vapor deposition to deposit rare earth on the surface of the NdFeB substrate. The NdFeB substrate is evenly stacked on the tray and enters the process chamber of the semiconductor process equipment in turn. The rare earth target is mounted under the electrode for sputter coating. According to the process requirements, the coating thickness of all substrates on the tray is required to be kept within a certain range, and the error of coating thickness on all substrates should be less than ±5%. Generally, when designing semiconductor process equipment, the moving direction of the tray is perpendicular to the length direction of the target. After the tra...

Claims

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Application Information

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IPC IPC(8): C23C14/34C23C14/16C23C14/56
CPCC23C14/34C23C14/165C23C14/56
Inventor 金晨李建银
Owner 北京七星华创集成电路装备有限公司
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