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Sintering jig and manufacturing method for electronic components

A technology of electronic components and manufacturing methods, which is applied in the field of electronic component sintering jigs and its manufacturing, can solve the problems of easy peeling off of external electrodes during sintering, and achieve the effects of reducing production implementation costs and improving yield

Inactive Publication Date: 2015-04-29
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to propose a sintering jig for electronic components and its manufacturing method, so as to solve the technical problem that the external electrode sintering is easy to fall off in the above-mentioned prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The invention proposes a method for manufacturing electronic components, including making a green body and making external electrodes on the green body. The outer electrodes are made on the green body in a sintering jig made of recrystallized silicon carbide, and the sintering jig passes the following steps production:

[0024] S1. Prepare a mixed material, which includes the following raw materials in weight percentage: 30-100 mesh silicon carbide powder 46%, 1500-3000 mesh silicon carbide powder 45%, 250-500 mesh silicon powder 4%, 250-500 mesh Mesh carbon powder 3% and binder 2%;

[0025] S2, making the mixed material into a green body;

[0026] S3. The green body is sintered in an argon atmosphere at a sintering temperature of 1500° C., then kept at a temperature of 5 hours, then raised to 2480° C., kept at a temperature of 1 hour, and then cooled to room temperature to obtain the sintered jig.

[0027] Optionally, the raw materials for making sintered fixtures al...

Embodiment 2

[0029] The sintering fixture of the present embodiment is made through the following steps:

[0030] S1. Prepare a mixed material, which includes the following raw materials in weight percentage: 30-100 mesh silicon carbide powder 47%, 1500-3000 mesh silicon carbide powder 41%, 250-500 mesh silicon powder 5%, 250-500 mesh Mesh carbon powder 4% and binder 3%;

[0031] S2, making the mixed material into a green body;

[0032] S3. The green body is sintered in an argon atmosphere at a sintering temperature of 1600° C., then kept at a temperature of 3 hours, then raised to 2480° C., kept at a temperature of 2 hours, and then cooled to room temperature, thereby obtaining the sintered jig.

Embodiment 3

[0034] The sintering fixture of the present embodiment is made through the following steps:

[0035] S1. Prepare a mixed material, which includes the following raw materials in weight percentage: 30-100 mesh silicon carbide powder 49%, 1500-3000 mesh silicon carbide powder 37%, 250-500 mesh silicon powder 5%, 250-500 mesh Mesh carbon powder 5% and binder 4%;

[0036] S2, making the mixed material into a green body;

[0037] S3. The green body is sintered in an argon atmosphere at a sintering temperature of 1700° C., then kept at a temperature of 4 hours, then raised to 2480° C., kept at a temperature of 6 hours, and then cooled to room temperature, thereby obtaining the sintered jig.

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Abstract

The invention discloses a sintering jig and a manufacturing method for electronic components. The manufacturing method for the electronic components comprises the steps of producing blanks and producing outer electrodes on the blanks, wherein the step of producing the outer electrodes on the blanks is carried out in the sintering jig prepared from recrystallized silicon carbide, and the sintering jig is prepared through the following steps: (1) preparing a mixed material which comprises 46-63% of silicon carbide powder of 30-100mesh, 24-45% of silicon carbide powder of 1500-3000mesh, 3-10% of silicon powder of 250-500mesh, 3-8% of carbon powder of 250-500mesh and 2-4% of a binding agent; (2) processing the mixed material into a green; (3) sintering the green to obtain the sintering jig. With the adoption of the manufacturing method disclosed by the invention, the technical problem that the outer electrodes the electronic components are easy to fall off during sintering can be greatly solved, and the production yield and capacity of the electronic components can be improved.

Description

technical field [0001] The invention relates to a sintering jig for electronic components and a manufacturing method thereof. Background technique [0002] In recent years, with the widespread use of chip components, the performance and appearance requirements of various aspects have also tended to be diversified. At the same time, some poor appearance of chip components restricts some electrical properties in turn. In existing chip components, when the external electrodes are sintered, the external electrodes often stick to the sintering fixture, causing the external electrodes to fall off when the material is unloaded and separated. The defect position after the external electrode falls off cannot be coated with a coating, resulting in poor appearance, virtual soldering, tombstone and other poor soldering problems during SMT surface mounting; and when the defect position coincides with the lead-out electrode, it will also cause poor electrical open circuit. Contents of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/565C04B35/622
Inventor 杨日章陈先仁
Owner SHENZHEN SUNLORD ELECTRONICS
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