A developable UV-curable hydrofluoric acid-resistant protective adhesive
A hydrofluoric acid-resistant and protective adhesive technology, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve the problems of easy falling off, easy failure, and increased cost.
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[0036] The preparation method of the developable UV-curable hydrofluoric acid-resistant protective adhesive comprises the following steps: stirring the resin, active monomer, photoinitiator, filler, auxiliary agent, and organic pigment at a temperature lower than 30°C according to the mass ratio Evenly, a developable UV-curable hydrofluoric acid-resistant protective adhesive can be obtained.
[0037] Test the viscosity, if the test result does not meet the set viscosity threshold, then adjust the viscosity to the viscosity threshold, the set viscosity threshold is the viscosity range of the developed developable UV curable hydrofluoric acid resistant protective adhesive. Viscosity is the main parameter that determines the performance of developable UV-curable hydrofluoric acid-resistant protective adhesive. If the viscosity is too high, it is not conducive to the coating of developable UV-curable hydrofluoric acid-resistant protective adhesive; if the viscosity is too small, th...
Embodiment 1
[0045] In this embodiment, the composition and proportioning (mass percentage) of each raw material that can develop UV curing hydrofluoric acid resistant protective glue are as follows:
[0046] Bisphenol A epoxy acrylic photocurable resin 50%, polyether-based urethane acrylate 20%, photoinitiator 3694.5%, dodecafluoroheptyl methacrylate 5%, trimethylolpropane tri(meth)acrylate 5%, pentaerythritol tri(meth)acrylate 5%, filler 8%, additives 2% and pigment P.R.2540.5%, stir and mix evenly.
[0047] According to the above test method of etching resistance performance, the etching resistance performance of the test plan is measured, the thickness of the protective film is 35mm, the etching time is 1.5h, the etching depth is 0.45mm, and the debonding film time is 30min.
Embodiment 2
[0049] In this embodiment, the composition and proportioning (mass percentage) of each raw material that can develop UV curing hydrofluoric acid resistant protective glue are as follows:
[0050] Bisphenol A epoxy acrylic photocurable resin 22%, PU modified epoxy acrylic resin 22%, aliphatic polyurethane acrylate 20%, photoinitiator 3696.5%, hexafluorobutyl acrylate 2%, dodecafluoromethacrylate 3% heptyl ester, 10% trimethylolpropane tri(meth)acrylate, 9% filler, 5% additive and 0.5% pigment P.R.
[0051] Measure the etching resistance of the test plan according to the above-mentioned etching resistance testing method, the thickness of the protective film is 60mm, the etching time is 3h, the etching depth is 1.10mm, and the debonding film time is 75min.
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