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Manufacturing method of fine silver-gold alloy bonding line for polycrystalline serial LED

A technology of silver-gold alloy and manufacturing method, which is applied in the field of micro-silver-gold alloy bonding wire and manufacturing for multi-crystal series LEDs, to achieve the effects of improving organizational structure, improving oxidation resistance, and reducing local stress concentration

Active Publication Date: 2015-03-04
HENAN POLYTECHNIC UNIV +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a kind of fine silver-gold alloy bonding wire and manufacturing method for multi-crystal series LED, which can solve the shortcomings of existing bonding wires, improve the production efficiency of bonding wires, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] The manufacturing method of the fine silver-gold alloy bonding wire for polycrystalline series LED in this embodiment is as follows:

[0013] (1) Smelting and continuous casting of silver-gold alloy bonding wire blanks:

[0014] a. Manufacturing Ag / Ce master alloy: Put 95% pure silver (purity higher than 99.99%) in a vacuum furnace crucible, and put 5% Ce (purity higher than 99.95%) in a vacuum furnace feeding box , Vacuum the furnace, the vacuum degree is higher than 5×10 -2 After Pa, charge high purity Ar 2 To 0.1Mpa, then re-evacuate until the vacuum degree is higher than 5×10 -2 After Pa, start to heat up, after the temperature rises to 600℃, stop vacuuming and charge the vacuum furnace with high purity Ar 2 To 0.5MPa; then continue to heat up to 1150℃, after the pure silver is completely dissolved and the silver liquid becomes clear, move the feeding box to add Ce into the crucible, and start to fill the Ag / Ce alloy liquid with high purity Ar 2 Stir for 18 minutes to co...

Embodiment 2

[0023] The manufacturing method of the fine silver-gold alloy bonding wire for polycrystalline series LED in this embodiment is as follows:

[0024] (1) Smelting and continuous casting of silver-gold alloy bonding wire blanks:

[0025] a. Manufacturing Ag / Ce master alloy: Put 95% pure silver (purity higher than 99.99%) in a vacuum furnace crucible, and put 5% Ce (purity higher than 99.95%) in a vacuum furnace feeding box , Vacuum the furnace, the vacuum degree is higher than 5×10 -2 After Pa, charge high purity Ar 2 To 0.3Mpa, then re-evacuate until the vacuum degree is higher than 5×10 -2 After Pa, start to heat up, after the temperature rises to 700℃, stop vacuuming and charge the vacuum furnace with high purity Ar 2 To 0.5MPa; then continue to heat up to 1200°C, after the pure silver is completely dissolved and the silver liquid becomes clear, move the feeding box to add Ce into the crucible, and start to fill the Ag / Ce alloy liquid with high-purity Ar 2 Stir for 20 minutes to c...

Embodiment 3

[0034] The manufacturing method of the fine silver-gold alloy bonding wire for polycrystalline series LED in this embodiment is as follows:

[0035] (1) Smelting and continuous casting of silver-gold alloy bonding wire blanks:

[0036] a. Manufacturing Ag / Ce master alloy: Put 95% pure silver (purity higher than 99.99%) in a vacuum furnace crucible, and put 5% Ce (purity higher than 99.95%) in a vacuum furnace feeding box , Vacuum the furnace, the vacuum degree is higher than 5×10 -2 After Pa, charge high purity Ar 2 To 0.5Mpa, then re-evacuate until the vacuum degree is higher than 5×10 -2 After Pa, start to heat up, after the temperature rises to 800℃, stop vacuuming and charge the vacuum furnace with high purity Ar 2 To 0.5MPa; then continue to heat up to 1250℃, after the pure silver is completely dissolved and the silver liquid becomes clear, move the feeding box to add Ce into the crucible, and start to fill the Ag / Ce alloy liquid with high purity Ar 2 Stir for 25 minutes to co...

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Abstract

The invention relates to a manufacturing method of a fine silver-gold alloy bonding line for polycrystalline serial LED. The fine silver-gold alloy bonding line comprises 35-55wt% of Au, 0.3-0.5wt% of Ce and the balance Ag. The manufacturing method comprises the following steps of 1, silver-gold alloy bonding line blank melting and continuous casting, 2, silver-gold alloy rod drawing and 3, silver-gold alloy line intermediate heat treatment. The manufacturing method solves the problems of ignited balls, ball offset and sharpening of the common silver-gold alloy bonding line, improves silver-gold alloy bonding line corrosion resistance, and solves the problem that the existing polycrystalline serial LED has a small bonding point size and produces an irregular first welding spot ball in bonding thereby causing welding spot short circuit and bonding strength reduction.

Description

Technical field [0001] The invention belongs to the technical field of semiconductor materials, and mainly relates to a fine silver-gold alloy bonding wire for polycrystalline series LEDs and a manufacturing method. Background technique [0002] The bonding wire (bonding alloy wire, bonding copper wire, bonding alloy wire, etc.) serves to connect the electrode of the silicon chip and the external lead-out terminal of the lead frame, and transmits the electrical signal of the chip and dissipates the heat generated in the chip. It is integrated Key material for circuit packaging. Bonding alloy wire has been widely used in the packaging field due to its excellent stability, but in wire bonding, the bonding alloy wire is expensive and the bonding interface is prone to "purple spots" (AuAl 2 ), "white spots" (Au 2 Al), Kirkendall Void, and low high-temperature strength have restricted the use of bond alloy wires in electronic packaging. Due to its low cost, copper bonding wires have ...

Claims

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Application Information

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IPC IPC(8): C22F1/14C22C5/02C22C5/06C22C30/00H01L33/62
CPCH01L24/43H01L2224/45139H01L2924/00011H01L2224/45H01L2224/43H01L2224/45144H01L2924/01058H01L2924/01079H01L2924/00012H01L2924/00H01L2924/01049H01L2924/01004H01L2924/01005
Inventor 曹军范俊玲杨雪梅李科张跃敏吕长春
Owner HENAN POLYTECHNIC UNIV
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