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Nanometer modified SiO2/epoxy acrylic acid composite resin, IMD ink and preparation method thereof

A technology of epoxy acrylic and epoxy acrylate, which is applied in the direction of ink, household utensils, applications, etc., can solve the problems that cannot be met, and it is difficult to meet the performance requirements of high temperature resistance of 300 degrees, and achieve the effect of good flexibility

Inactive Publication Date: 2015-01-28
GUANGZHOU UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional inks currently on the market will undergo temperature changes at a high temperature of 200 degrees, and it is difficult to meet the performance requirements of 300 degrees high temperature resistance, let alone the above comprehensive performance requirements

Method used

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  • Nanometer modified SiO2/epoxy acrylic acid composite resin, IMD ink and preparation method thereof
  • Nanometer modified SiO2/epoxy acrylic acid composite resin, IMD ink and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] First add 2g of deionized water, 4g of ammonia water and 100g of acetone solvent into a three-necked flask equipped with a condensation and electric stirrer device, and mix them uniformly at a speed of 300rpm, then mix 4g of tetraethyl orthosilicate and 50g of acetone solvent evenly Finally, drop it into a three-necked flask at a certain speed within 1 hour, and react at 70°C and 300rpm for 24h to obtain nano-SiO 2 Sol.

[0025] Mix 2g of vinyltriethoxysilane coupling agent with 50g of acetone solvent, and then add it dropwise to the above nano-SiO2 within 1 hour. 2 In the three-necked flask of the sol, the modified nano-SiO 2 Sol.

[0026] Add 0g, 6g, 18g, and 30g of nano-SiO to a four-necked flask equipped with a thermometer, a stirring device, a reflux condenser, and a dropping device. 2 sol, and heated to 80°C. Slowly drop 22g styrene, 9g butyl acrylate, 6.9g hydroxyethyl methacrylate, 8.5g epoxy acrylate and 0.93g azobisisobutyronitrile initiator into a four-ne...

Embodiment 2

[0027] Example 2 Nano SiO 2 / Preparation of epoxy acrylic polyurethane based IMD ink

[0028] The 30g nanometer SiO that embodiment 1 obtains 2 / epoxy acrylic resin (EPAc / SiO 2 (0%), EPAc / SiO 2 (1%), EPAc / SiO 2 (3%), EPAc / SiO 2 (5%)) as the main connection, respectively add curing agent 3.92g, 4.13g, 4.53g, 5.28gN3390 and 0.54g phthalic anhydride, 1g rosin phenolic resin 2104, 1g chlorinated polypropylene, 5g carbon black, 0.5 gBYK163, 0.1g BK-306, 0.1g BYK-141, add ethyl acetate until the total amount is 100g, and the solid content is 30%. According to the above proportions, after mixing the pigment, resin, wetting and dispersing agent, and solvent, use a Japanese Mitsubishi fine grinder to grind and disperse it for 1 hour to obtain a color paste, and then add quick-drying agent, adhesion promoter, leveling agent, Defoamer, curing agent, etc. are mixed and stirred evenly to obtain IMD ink, and EPAc / SiO 2 (0%), EPAc / SiO 2 (1%), EPAc / SiO 2 (3%), EPAc / SiO 2 (5%)) are...

Embodiment 3

[0029] Example 3 Nano SiO 2 / Epoxy acrylic polyurethane based IMD ink properties

[0030]The heat resistance of the ink film refers to the national standard GB / T 1735 "Determination of Heat Resistance of Paint Film". The heat resistance of the paint film refers to the ability of the paint film to maintain its apparent state or mechanical properties at a given temperature, using a muffle furnace After heating and reaching the specified temperature and time, the heat resistance of the paint film can be expressed by the change of physical properties or the change of the surface of the paint film. In this experiment, the heat resistance of the ink film is represented by the time when the ink film does not suffer from wrinkling, bubbling, cracking or discoloration at 300°C. The hardness of the coating film is measured with reference to the national standard GB / T 6739-1996 "Pencil Test Method for Coating Film Hardness". It is divided into 13 grades from 6H to 6B, of which 6H is th...

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Abstract

The present invention discloses a nanometer modified SiO2 / epoxy acrylic acid composite resin, an IMD ink and a preparation method thereof. The preparation method comprises: (1) adopting an organic solvent as a co-solvent and adopting tetraethyl orthosilicate as a precursor to prepare a SiO2 sol through alkali-catalyzed hydrolysis condensation polymerization; (2) adopting a vinyl silane coupling agent to carry out surface modification on the nanometer SiO2 to obtain the modified nanometer SiO2 sol; and (3) adopting the modified nanometer SiO2 sol, and carrying out in situ polymerization of the modified nanometer SiO2 sol, an epoxy acrylate and an acrylic acid monomer to prepare the SiO2 / epoxy acrylic acid resin. Compared with the existing ink, the ink of the present invention can not produce the color change for 3 min at the temperature of 300 DEG C, has characteristics of good flexibility, good impact resistance, good adhesion, and good water-acid-alkali-resistance comprehensive performance, and can meet the IMD product processing requirements. In addition, the IMD ink is the special ink for plastic product inside-mold decoration thermal transfer printing technology, and can be widely used for finishing of notebook cases, mobile phone housings, vehicle panels, appliance parts and other plastic products.

Description

technical field [0001] The invention relates to the technical field of ink, in particular to a nano-modified SiO 2 / Epoxy acrylic composite resin and IMD ink preparation method thereof. Background technique [0002] In-mold decoration thermal transfer printing technology for plastic products requires IMD inks to have high temperature resistance (hot injection molding temperature is 300 degrees for 30s without fading), and good flexibility, impact resistance, adhesion, water, acid and alkali resistance. The traditional inks currently on the market will undergo temperature changes at a high temperature of 200 degrees, and it is difficult to meet the performance requirements of 300 degrees high temperature resistance, let alone the above comprehensive performance requirements. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art, to provide a nano-modified SiO 2 / Epoxy acrylic composite resin and its IMD ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F290/00C08F212/08C08F220/18C08F220/28C08F2/44C08K9/06C08K3/36C09D11/107
Inventor 林璟
Owner GUANGZHOU UNIVERSITY
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