Moisture-curable polyurethane hot melt resin composition, adhesive and article

A moisture-curing type resin composition technology, applied in polyurea/polyurethane adhesives, adhesives, adhesive additives, etc., can solve the problems of limited use, insufficient flexibility of adhesives, and inability to be practically applied. Excellent drop impact resistance and excellent opening time

Active Publication Date: 2014-12-24
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the laminated body bonded using this adhesive is immersed in water, water may intrude into the laminated body within a relatively short period of time, and there is a problem that the waterproof performance is insufficient.
[0006] In addition, although the above-mentioned heat-and-moisture-resistant hot-melt adhesive composition has the advantage of being able to bond even at low temperatures, it cannot be practically used when rapid curing is required. The softness of the agent itself is not sufficient, and there is a problem that the usable applications are limited.

Method used

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  • Moisture-curable polyurethane hot melt resin composition, adhesive and article
  • Moisture-curable polyurethane hot melt resin composition, adhesive and article
  • Moisture-curable polyurethane hot melt resin composition, adhesive and article

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0109] Hereinafter, the present invention will be described in more detail by way of examples.

Synthetic example 1

[0111]

[0112] 300 parts by mass of methyl ethyl ketone was added to a reaction vessel equipped with a thermometer, a stirrer, and a cooling pipe, and after setting the temperature inside the vessel to 80°C, 340 parts by mass of methacrylic acid, 340 parts by mass of butyl methacrylate, 2 - a mixture of 10 parts by mass of hydroxyethyl ester and 8.5 parts by mass of azobisisobutyronitrile dissolved in 160 parts by mass of methyl ethyl ketone, mixed and reacted for 16 hours to obtain acryloyl polyol-1 (non-volatile components: 52% by mass, viscosity: 20,000 mPa·s (23° C.)).

Embodiment 1

[0114] In a four-necked flask equipped with a thermometer, a stirrer, an inert gas inlet, and a reflux cooler, 15 parts by mass of polypropylene glycol (number average molecular weight: 1,000, hereinafter referred to as "PPG1000"), polypropylene glycol (number average molecular weight: 2,000, Hereinafter referred to as "PPG2000") 15 parts by mass, crystalline PEs-2 (substance obtained by reacting 1,6-hexanediol and 1,12-dodecanedicarboxylic acid, number average molecular weight; 3,500) 20 parts by mass , Amorphous PEs-1 (a product obtained by reacting a 6-mol adduct of propylene oxide of bisphenol A with sebacic acid and isophthalic acid, number average molecular weight; 2,000) 7.5 parts by mass, Amorphous PEs -2 (substance obtained by reacting neopentyl glycol, diethylene glycol, 1,6-hexanediol and adipic acid, number average molecular weight; 2,000) 7.5 parts by mass, acryloyl polyol-120 parts by mass, in Dehydration was performed at 100° C. under reduced pressure until the ...

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Abstract

The present invention addresses the problem of providing a moisture-curable polyurethane hot melt resin composition which has excellent waterproof properties, fast curing properties, flexibility and the like. The present invention provides: a moisture-curable polyurethane hot melt resin composition which is characterized by containing (i) a urethane prepolymer having an isocyanate group, which is obtained by reacting (A) a polyol that contains (A-1) a polyether polyol, (A-2) a crystalline polyester polyol, (A-3) an amorphous polyester polyol and (A-4) an acrylic polyol with (B) a polyisocyanate, and (ii) a curing catalyst that is represented by general formula (1); an adhesive which is obtained using the moisture-curable polyurethane hot melt resin composition; and an article. An adhesive that is obtained using the moisture-curable polyurethane hot melt resin composition of the present invention is suitable not only for use in fiber bonding and building material lamination but also for use in bonding of optical members.

Description

technical field [0001] The present invention relates to a moisture-curable polyurethane hot-melt resin composition excellent in waterproofness, rapid curing property, flexibility, etc., and an adhesive and an article using the composition. Background technique [0002] Since moisture-curing polyurethane hot-melt adhesives are solvent-free, various researches have been conducted so far as environment-friendly adhesives, centering on fiber bonding and lamination of building materials, and they are also recognized in the industry. widely used. [0003] In addition, in recent years, in the bonding of optical parts, with the increase in the demand for weight reduction and thinning of optical parts, acrylic adhesives, which are the mainstream, have been replaced by hot-melt adhesives. seminar. [0004] As the above-mentioned adhesive, for example, an adhesive using a heat-and-moisture resistant hot-melt adhesive composition characterized by having a flow initiation temperature o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/12C08G18/20C08G18/40C08L75/04C09J11/06C09J175/04
CPCC08G18/12C08G18/20C08G18/2081C08G18/40C08G18/4009C08G18/4202C08G18/48C08G18/6254C08G18/7671C09J11/06C09J175/04C09J2301/304C08G18/4063C08G18/4216C08G18/4238C08G18/4808C08G18/4854C08G18/7657Y10T428/31504C08G18/307C08G18/10C08G18/76C08L75/04C09J7/00C09J175/06C09J175/08
Inventor 金川善典藤原丰邦野中谅
Owner DIC CORP
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