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Self-healing functional epoxy resin containing biphenyl structure and preparation method of self-healing functional epoxy resin

A technology of epoxy resin and biphenyl structure, which is applied in the field of self-healing functional epoxy resin and its preparation, can solve the problem of limited toughness of resin cured product, and achieve the effect of inhibiting chain segment movement and good heat resistance.

Inactive Publication Date: 2014-12-10
HAIAN INST OF HIGH TECH RES NANJING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The applicant proposed a self-healing epoxy resin based on naphthalene ring and furan group structure in 2013, which has good high temperature resistance and self-healing efficiency. However, due to the large-scale planar structure of the naphthalene ring, the movement of molecules around the axis is inhibited , the toughness of cured resin is limited

Method used

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  • Self-healing functional epoxy resin containing biphenyl structure and preparation method of self-healing functional epoxy resin
  • Self-healing functional epoxy resin containing biphenyl structure and preparation method of self-healing functional epoxy resin
  • Self-healing functional epoxy resin containing biphenyl structure and preparation method of self-healing functional epoxy resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Add 10.5 g of 4,4'-diphenol, 46 g of epichlorohydrin and 18.5 g of n-butanol into a 125 mL four-necked flask equipped with mechanical stirring, thermometer, reflux condenser, digitally controlled sampling pump and nitrogen introduction device , slowly increase the temperature of the oil bath to 60°C, and after the 4,4'-biphenol is completely dissolved, slowly add 16 g of NaOH solution (30wt%) with a numerical control injection pump, and the injection is completed within 1 hour, and the reaction The temperature was controlled at 60°C, and the reaction was continued for 3 hours. After the reaction was completed, the sodium chloride formed was removed by cooling and filtration, the solvent was removed by distillation under reduced pressure, dissolved in toluene again, and washed with deionized water for 3 times. Recrystallization gave the product as a white solid. Dissolve 20 g of the above-mentioned white solid product in 60 g of xylene and place it in a 125 mL four-necke...

Embodiment 2

[0022] Add 12 g of 4,4'-diphenol, 47 g of epichlorohydrin and 20 g of n-butanol into a 125 mL four-necked flask equipped with mechanical stirring, a thermometer, a reflux condenser, a numerically controlled sampling pump, and a nitrogen introduction device, Slowly increase the temperature of the oil bath to 55°C. After the 4,4'-biphenol is completely dissolved, slowly add 14 g of NaOH solution (30wt%) with a numerically controlled injection pump. The injection is completed within 1 hour. The reaction temperature Control the temperature at 60°C and continue the reaction for 4 hours. After the reaction is completed, cool and filter to remove the generated sodium chloride, distill under reduced pressure to remove the solvent, dissolve it again with toluene, wash with deionized water for 3 times, remove the solvent, and reapply with dichloromethane. Crystallization gave the product as a white solid. Dissolve 18 g of the above-mentioned white solid product in 62 g of xylene and pla...

Embodiment 3

[0024] The 100g self-healing functional epoxy resin containing biphenyl structure prepared by the above two examples is mixed with 21.2 g DDS and 5.1 g BDM, dissolved in 250 ml acetone and 250 ml N,N-dimethylformamide mixed solvent, After the dissolution was completed, the solvent was distilled off under reduced pressure to obtain a mixture of resin and curing agent 126g, cured at 120°C for 1h, 180°C for 1h, and 220°C for 2h to obtain a cured resin with a glass transition temperature of 207°C (DMA method), using the scratch method , after the material was heated at 180℃ for 6h, the repair size efficiency was 81%.

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Abstract

The invention discloses a self-healing functional epoxy resin containing a biphenyl structure. The technical scheme of the invention is implemented through mixing formula amounts of 4,4'-biphenol, epichlorohydrin and a cosolvent at a temperature of 50-60 DEG C, adding a formula amount of phase transfer catalyst, uniformly mixing the obtained object so as to obtain a transparent solution, slowly adding a formula amount of sodium hydroxide to react for 1-6 h, after the reaction is completed, cooling and filtering the obtained product so as to remove generated sodium chloride, and carrying out water washing and reduced pressure distillation for removing unreacted epichlorohydrin and cosolvent, so that 4,4'-biphenol diglycidyl ether epoxy resin is obtained; and in parts by weight, dissolving 30-32 parts of the 4,4'-biphenol diglycidyl ether epoxy resin into 50-60 parts of a solvent, slowly adding 9-10 parts of furfuryl amine into a reaction container to react, and carrying out cooling and reduced pressure distillation on the obtained product so as to remove the solvent, thereby obtaining a biphenyl structure containing self-healing functional epoxy resin. The self-healing functional epoxy resin containing the biphenyl structure and the preparation method of the self-healing functional epoxy resin have the beneficial effects that obtained cured substances have the advantages of high toughness and good heat resistance, and can be used as a matrix of a high-performance composite material.

Description

technical field [0001] The invention relates to the technical field of epoxy resins, in particular to a self-repairing functional epoxy resin containing a biphenyl structure and a preparation method thereof. Background technique [0002] As an important class of thermosetting resins, epoxy resin has excellent adhesive properties, wear resistance, mechanical properties, electrical insulation properties, chemical stability, high and low temperature resistance, low shrinkage, easy processing and low cost, etc. It has been widely used in advanced composite materials and other fields. [0003] Epoxy resin is the most commonly used matrix resin for high-performance composite materials. Due to the thermosetting characteristics of epoxy resin, it becomes an insoluble and infusible cured product after processing, and the secondary processing technology is very limited, especially when used as a composite material. , under the condition of low-energy impact, the matrix cracks and mic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50C08G59/24
Inventor 任华张亚曹婷婷仇叶云
Owner HAIAN INST OF HIGH TECH RES NANJING UNIV
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