OLED (organic light emitting diode) packaging structure
A technology of encapsulation structure and glass encapsulation material, applied in the direction of organic light-emitting device structure, electrical components, organic light-emitting devices, etc., can solve the problems of affecting the service life of OLEDs, increasing the number of OLED displays, affecting the lifespan of OLEDs, etc.
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[0021] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0022] combined with figure 1 , OLED encapsulation structure, including: an upper glass substrate 1, a lower glass substrate 2, a glass encapsulation material 3 and a water heat release layer 4.
[0023] The upper glass substrate 1 is one of the important components of the OLED device, and is generally composed of a transparent glass substrate.
[0024] The lower glass substrate 2 is one of the important components of the OLED device, and OLED chips, electrodes (not shown in the figure), etc. are arranged on the lower glass substrate 2 .
[0025] The glass encapsulant 3 connects the upper glass s...
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