A thermally conductive and insulating epoxy resin potting compound and its preparation method

Abstract

The invention discloses a thermally conductive and insulating epoxy resin potting glue, which is composed of epoxy resin, curing agent, toughening agent, diluent, filler, accelerator and defoamer, and the weight ratio of each component is: A component : 100 parts of epoxy resin, 10-30 parts of diluent, 5-15 parts of filler, 0.5-1 part of defoamer, 3-5 parts of coupling agent; B component: 78-145 parts of curing agent, toughening 10-40 parts of agent, 5-10 parts of filler, 0.1-3 parts of accelerator, 0.5-1 part of defoamer; A / B weight ratio 1:1. The toughening agent is epoxy-terminated hydroxyl polybutadiene acrylonitrile; the filler is nano-silicon magnesium nitride, nano-silicon carbide, nano-aluminum nitride, nano-boron nitride, high-sphericity nano-alumina and The composite powder composed of nanometer silicon nitride has an average particle size of 40-60nm. The potting compound not only has good thermal conductivity, but also has good insulation performance.

Description

technical field [0001] The invention relates to the technical field of adhesive preparation, in particular to a thermally conductive and insulating epoxy resin potting adhesive and a preparation method thereof. Background technique [0002] Epoxy resin potting glue is a kind of thermosetting polymer composite material with good adhesion, corrosion resistance, electrical insulation, high strength and other properties. Indispensable basic material in many industrial fields. [0003] With the development of microelectronics and integrated circuits in the direction of high speed, high density, miniaturization, and light weight, the volume of electronic components and logic circuits is continuously compressed, and the heat generated per unit volume of electronic equipment increases sharply, so the thermal conductivity will decrease. Affect the life and reliability of electronic components and electronic equipment. In order to ensure the normal operation of electronic components...

AI Technical Summary

Problems solved by technology

Although metal materials have high thermal conductivity, they can also be used as fillers for thermally conductive polymer composite materials. However, due to the electrical conductivity of metal materials, the finished products have poor insulation and are easy to break down, which affects the efficiency and life of electronic components.

The thermal conductivity of silica micropowder commonly used in inorganic thermally conductive fillers is low, and the thermal conductivity of potting materials filled with silica micropowder is also low, less than 0.6W / (m K), which is not conducive to the heat dissipation of electrical components

Non-spherical alumina, boron nitride, aluminum nitride and other inorganic fillers have high thermal conductivity, but the particle size is large (generally 400 mesh), poor affinity with resin, uneven distribution, easy to precipitate

Images