Semiconductor-wafer-surface-protective adhesive tape

Abstract

A semiconductor-wafer-surface-protective adhesive tape having a pressure-sensitive adhesive layer on a substrate film, wherein the thickness of the adhesive layer is 10mum or more, the surface free energy (gammas) of the surface of the adhesive layer is 30-35 mN / m, the contact angle (thetal I) in relation to diiodomethane is 54-60 DEG , the adhesive force in relation to an SUS280 polished surface at 23 DEG C is 0.8-4.3 N / 25mm, and the adhesive force in relation to the SUS280 polished surface when heat-releasing at 50 DEG C in comparison to the adhesive force when releasing at 23 DEG C is 50% or less.

Description

technical field [0001] The present invention relates to an adhesive tape (adhesive tape) for protecting the surface of a semiconductor wafer. More specifically, it is related with the adhesive tape for surface protection of the semiconductor wafer used when grinding a semiconductor wafer into a thin film. Background technique [0002] A semiconductor package is manufactured by slicing a high-purity silicon single crystal or the like into a semiconductor wafer, and then forming an integrated circuit on the surface of the wafer by ion implantation, etching, or the like. The semiconductor wafer has a desired thickness by grinding, polishing, or the like on the back surface of the semiconductor wafer on which the integrated circuit is formed. At this time, in order to protect the integrated circuit formed on the surface of the semiconductor wafer, an adhesive tape for protecting the surface of the semiconductor wafer is used. The semiconductor wafer subjected to backside grind...

AI Technical Summary

Problems solved by technology

[0010] However, the UV-curable surface protection tape requires an ultraviolet irradiation process, so the process management is cumbersome, and its reactivity is high, so it often reacts with the active surface of the semiconductor wafer that has been specially surface-treated to cause poor peeling or chip cracking problem

On the other hand, in the surface protection tape using pressure-sensitive adhesive, the adhesive cannot be cured by ultraviolet radiation, so it is difficult to improve the adhesion and prevent the adhesive from remaining, and it is difficult to apply to the discrete type. Devices with large step differences, bump wafers and other devices with bumps

[0011] In order to solve these problems, methods such as using two layers of adhesives or using resin in the middle layer to ensure adhesion have been considered, but if the adhesive that is in contact with the adherend is not UV-curable, then It is difficult to suppress the occurrence of adhesive residue, or when using a pressure-sensitive adhesive, it is necessary to clean the adherend

[0012] In view of these problems, by further adjusting the value of the contact angle to diiodomethane to solve the problem in the ultraviolet curable adhesive (see Patent Document 4), or to seek a solution to the problem in the same way for the pressure-sensitive adhesive ( Referring to Patent Document 5), however, the problem of adhesive residue due to differences in wafer surface conditions or differences in the depth or shape of unevenness such as scribe lines cannot be completely solved.

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