A kind of al-si-cu-zn series low-melting-point aluminum-based solder and preparation method thereof

Abstract

The invention belongs to the field of welding materials, and discloses Al-Si-Cu-Zn low-melting-point aluminum-based brazing filler metal and a preparing method of the Al-Si-Cu-Zn low-melting-point aluminum-based brazing filler metal. The Al-Si-Cu-Zn low-melting-point aluminum-based brazing filler metal comprises, by mass, 3.50%-4.50% of silicone, 15%-23% of copper, 10%-24% of zinc, 0.80%-1.20% of manganese, 0.80%-1.20% of magnesium, 0.02%-0.08% of strontium and the balance aluminum. Dosing is carried out according to the component contents, then the components are melted in a specific sequence and refined through hexachloroethane two times to carry out casting to obtain an alloy blank, and finally hot rolling is carried out on the alloy blank multiple times to obtain the foil-shaped aluminum-based brazing filler metal. The Al-Si-Cu-Zn low-melting-point aluminum-based brazing filler metal has the advantages of being low in melting point, excellent in brazing technology performance and low in cost, can be widely used for aluminum-based materials, and can be particularly used for brazing Al-Mn alloy materials.

Description

technical field [0001] The invention belongs to the field of welding materials, and in particular relates to an Al-Si-Cu-Zn series low-melting-point aluminum-based solder and a preparation method thereof. Background technique [0002] Aluminum and aluminum alloys occupy a unique position in modern industrial materials due to their low density, high thermal conductivity and electrical conductivity (only after Ag, Cu, and Au), high strength, and good corrosion resistance. As aluminum and aluminum alloys are more and more widely used, higher requirements are put forward for their connection technology. Aluminum alloy welding technology is mainly divided into fusion welding, resistance welding and brazing. Among them, brazing is a method of filling the joint gap by melting and filling the solder material with a lower melting point than the base metal to realize the connection. It has the advantages of low heating temperature and no melting of the base metal. It has less influen...

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Problems solved by technology

For example, although the Al-9.6Si-20Cu solder developed in the article "Joining6061aluminumalloywithAl-Si-Cufillermetals" published in the 488th issue of "Journal of Alloys and Compounds" in 2009 by S.Y.Chang et al. has significantly increased fluidity relative to Al-Si, the resulting metal The high brittleness of the inter-compound A12Cu deteriorates the performance of the solder, and at the same time, the processing performance is poor, and it is difficult to process it into a wire or foil; Yu Wenhua from Beijing University of Aeronautics and Astronautics et al. A series of Al-Si-Cu-Ni solders were also studied in the "Effects of Alloy Elements Cu, Si, Ni on Al-based Solders" published in "Materials". improved, but the processing performance is still very poor, and the melting point of the solder is high; Yu Weiyuan of Lanzhou University of Technology published "Low Melting Point Aluminum-based Solder Properties" in the 2nd issue of "Journal of Lanzhou University of Technology" in Volume 38 in 2012 A series of Al-Si-Cu-Zn-Sn solders were studied in the middle, although the addition of Zn and Sn can not only reduce the melting temperature of the solder, but also improve the wettability and fluidity of the solder, but the corresponding solder The soldering temperature is still as high as 560°C; Japan Mamoto Takashi and others studied Al-Si-Ge It is a brazing filler metal, but due to the high Ge content, the processability of the brazing filler metal is poor and the cost obviously increases; a kind of Al-Si-Cu-Zn-Sn-Ni aluminum-based brazing filler metal and its preparation method are disclosed in the patent CN102319963B, but In order to achieve the effects of low melting point, high strength, good wettability and spreadability, improved metals such as Sn, Ni, Ce and Zr are added to the material. These metals are expensive and increase the material cost, and the melting point of the solder is still as high as 516.6°C, it is difficult to achieve brazing at 520°C