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Method for preparing polyamide-based heat conduction composite material through melt blending

A thermally conductive composite material and melt blending technology, which is applied in the field of preparation of polymer-based composite materials, can solve the problem of low thermal conductivity of polymer materials, and achieve the advantages of improving dispersibility, improving thermal conductivity and mechanical properties, and improving thermal conductivity. Effect

Inactive Publication Date: 2014-06-18
HANGZHOU QIANSHI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem of low thermal conductivity of polymer materials by means of melt blending, and to provide a method for preparing polyamide-based thermally conductive engineering plastics with high thermal conductivity, excellent mechanical properties and processability

Method used

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  • Method for preparing polyamide-based heat conduction composite material through melt blending
  • Method for preparing polyamide-based heat conduction composite material through melt blending

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Firstly, 400g of thermally conductive filler is surface treated with 0.5% coupling agent NDZ-311 in a high-speed mixer; then the carrier resin / thermally conductive filler / antioxidant / anti-ultraviolet light stabilizer with a mass ratio of 10:400:0.5:1 A twin-screw extruder is used to pelletize the multifunctional masterbatch together. The temperature of the extruder barrel is controlled at 120℃~140℃. Finally, the obtained multifunctional masterbatch is mixed with 100g polyamide 6 and 10g heat The homogenous liquid crystal polymer is mixed uniformly and dried together in a vacuum at 80°C for 4 hours. A twin-screw extruder is used to prepare a polyamide-based thermally conductive composite material. The temperature of the barrel is controlled at 210°C to 280°C and the vacuum device is kept open.

[0017] The thermal conductivity composite material prepared above was prepared by injection molding. The performance test results are as follows: the thermal conductivity is 6.5W / m·k...

Embodiment 2

[0019] First, use 1% coupling agent NDZ-311 for surface treatment of 400g of thermally conductive filler in a high-speed mixer; then, the mass ratio of carrier resin / thermally conductive filler / antioxidant / ultraviolet light stabilizer is 40:400:0.5:1 A twin-screw extruder is used to pelletize the multifunctional masterbatch together. The temperature of the extruder barrel is controlled at 120℃~140℃. Finally, the obtained multifunctional masterbatch is mixed with 100g polyamide 6 and 10g heat The homogenous liquid crystal polymer is uniformly mixed and dried together in a vacuum at 80°C for 4 hours. A twin-screw extruder is used to extrude the polyamide-based thermally conductive composite material. The temperature of the barrel is controlled at 210-280°C and the vacuum device is kept open.

[0020] The thermal conductivity composite material prepared above was injection molded and the performance test results are as follows: thermal conductivity is 5.7W / m·k, tensile strength 56.3M...

Embodiment 3

[0022] Firstly, 700 g of the thermally conductive filler is surface treated with 1.5% titanate coupling agent NDZ-311 in a high-speed mixer; then the mass ratio of the carrier resin / thermally conductive filler / antioxidant / antioxidant is 10:700:1:3. The ultraviolet light stabilizer is granulated together with a twin-screw extruder to make a multifunctional masterbatch. The temperature of the extruder barrel is controlled at 120℃~140℃; finally, the multifunctional masterbatch is mixed with 100g of polyamide 6 and 10g of thermotropic liquid crystal polymer is mixed uniformly, dried together at 80℃ for 4 hours, and extruded by twin screw extruder to prepare polyamide-based thermally conductive composite material. The temperature of the barrel is controlled at 210~280℃, and the vacuum device is kept on. .

[0023] The thermally conductive composite material prepared above was injection molded and the performance test results are as follows: thermal conductivity is 9.5W / m·k, tensile st...

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Abstract

The invention relates to a method for preparing polyamide 6-based heat conduction plastic through melt blending. The method comprises the following steps: 1, preparing a multifunctional master batch from an elastomer which contains a polar group and is used as a carrier and coupling agent treated heat conduction inorganic filler particles, an antioxidant, an ultraviolet stabilizing agent and the like through a double-screw extruder; and 2, preparing the heat conduction composite material from polyamide 6, a thermotropic liquid crystal polymer and the master batch prepared in the first step through the double-screw extruder. The polyamide 6-based composite material prepared by the method disclosed by the invention is high in heat conduction performance, high in forming processing property and high in mechanical property, is suitable for injection molding, and can be widely applied to electronic appliances, mobile phone shells and LED (light emitting diode) lamp products; the heat dissipation performance of a product at high temperature is improved, and the service life of the product is prolonged.

Description

Technical field [0001] The invention relates to a method for preparing a polymer-based composite material with higher thermal conductivity, in particular to a method for preparing a thermally conductive polymer / inorganic composite material suitable for injection molding. Background technique [0002] With the rapid development of information technology, electronic components and electronic equipment have developed in the direction of "thin, light, and small". The rapid increase in circuit density and load capacity will cause the local temperature of electronic components to rise sharply and reduce their life. Traditional electronic component heat dissipation bodies and radiation heat dissipation plates are mainly made of metal materials, ceramics, and ceramic materials, which are difficult to process and heavy, which is not conducive to the development of electronic appliances in the direction of "thin, light, and small". Therefore, engineering plastics with thermal conductivity,...

Claims

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Application Information

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IPC IPC(8): B29B9/06C08L77/02C08L51/06C08L67/04C08K13/06C08K9/04C08K3/22C08K3/08C08K7/06
Inventor 董玉欣王鑫蔡伟王勇杰乔梁车声雷姜力强郑精武
Owner HANGZHOU QIANSHI TECH
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