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Epoxy-modified maleic anhydride copolymer prepolymer and its resin composition, preparation method and application

A technology of resin composition and maleic anhydride, applied in chemical instruments and methods, synthetic resin layered products, circuit substrate materials, etc. problems such as low transition temperature

Active Publication Date: 2016-06-08
SWANCOR JIANGSU NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The resin system currently used for copper foil substrates and printed circuit boards is epoxy resin, generally using standard FR4 substrates, and its main component is brominated epoxy resin made of bisphenol A epoxy resin and tetrabromobisphenol A , using dicyandiamide as a curing agent, and then adding accelerators and solvents, the disadvantages of this epoxy resin composition are that the glass transition temperature (Tg) is too low (120-140°C) and the heat resistance is poor. Using multifunctional epoxy resin instead of bisphenol A epoxy resin can improve the disadvantage of low glass transition temperature (Tg) by using the increase of crosslinking density, but it does not contribute much to improving heat resistance and electrical properties

Method used

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  • Epoxy-modified maleic anhydride copolymer prepolymer and its resin composition, preparation method and application
  • Epoxy-modified maleic anhydride copolymer prepolymer and its resin composition, preparation method and application
  • Epoxy-modified maleic anhydride copolymer prepolymer and its resin composition, preparation method and application

Examples

Experimental program
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Embodiment 1

[0072] 1) Preparation of maleic anhydride copolymer prepolymer solution:

[0073] With 100 parts by weight of solid styrene / maleic anhydride copolymer, add 130 parts by weight of methyl ethyl ketone solvent, dissolve into liquid styrene / maleic anhydride copolymer, add 27 parts by weight of benzyl alcohol and 0.635 parts by weight of 4 - tert-butyl-2,6-dimethyl-aniline, stirred and mixed at a temperature of 80° C. for 10 hours to obtain a solution.

[0074] 2) Preparation of epoxy-modified maleic anhydride copolymer prepolymer:

[0075] Mix 100 parts by weight of the maleic anhydride copolymer prepolymer solution in step 1) with 45.6 parts by weight of bisphenol A epoxy resin and 0.635 parts by weight of 4-tert-butyl-2,6-dimethyl-aniline , Stirring and mixing at a temperature of 80°C for 8 hours.

[0076] 3) Preparation of resin composition of epoxy-modified maleic anhydride copolymer prepolymer:

[0077] With 30 parts by weight of step 2) the epoxy-modified maleic anhydride...

Embodiment 2

[0081] 1) Preparation of maleic anhydride copolymer prepolymer solution:

[0082] The preparation method is as described in Example 1.

[0083] 2) Preparation of epoxy-modified maleic anhydride copolymer prepolymer:

[0084] With 30 parts by weight of the maleic anhydride copolymer prepolymer in step 1) and 45.6 parts by weight of dicyclopentadiene type epoxy resin and 0.635 parts by weight of 4-tert-butyl-2,6-dimethyl- Aniline was obtained by stirring and mixing at a temperature of 80°C for 10 hours.

[0085] 3) Preparation of resin composition of epoxy-modified maleic anhydride copolymer prepolymer:

[0086] With 30 parts by weight of epoxy-modified maleic anhydride copolymer prepolymer in step 2), 100 parts by weight of bisphenol A novolak epoxy resin, 30 parts by weight of phenolic resin, 0.1 parts by weight of 2-formaldehyde imidazole, 100 parts by weight of fused silica, 20 parts by weight of flame retardant and 30 parts by weight of propylene glycol methyl ether were m...

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Abstract

The invention provides an epoxy modified maleic anhydride copolymer prepolymer with a structural formula shown as formula (I) and a resin composition containing the same. The resin composition using the epoxy modified maleic anhydride copolymer prepolymer with a structural formula shown as formula (I) has good heat resistance and excellent electrical properties, and the viscosity does not rise along with time variation to affect the quality of a semi-cured film. At the same time, the resin composition is suitable for making semi-cured films and copper clad laminates, and can be applied to general or high frequency printed circuit boards.

Description

technical field [0001] The invention relates to an electronic material, in particular to an epoxy-modified maleic anhydride copolymer prepolymer and its resin composition, preparation method and application. Background technique [0002] Epoxy resin has been widely used in copper clad laminate (coppercladlaminate, CCL) and printed circuit board (printed circuit board, PCB) for many years, mainly because of epoxy resin and reinforcing materials such as glass fiber cloth, glass fiber mat, paper base, etc. Good bonding strength; and no volatile components will be produced during curing, and the molding shrinkage is small. The copper foil substrate produced has excellent mechanical strength, electrical insulation, chemical resistance, good dimensional accuracy and easy processing. It has become the current printing industry. The most important raw material in the circuit board. [0003] At present, the copper foil substrates used in printed circuit boards are mainly FR-4 boards...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F8/00C08F8/14C08F222/08C08L35/06C08L63/00C08L61/06C08K3/36C08G59/32C08G59/40C08J5/24B32B15/092B32B15/098B32B27/04B32B27/38H05K1/03
Inventor 陈清源
Owner SWANCOR JIANGSU NEW MATERIALS CO LTD
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