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Beryllium-containing low-silver cadmium-free silver solder

A technology of silver solder, mass percentage, applied in the direction of welding/cutting medium/material, welding medium, metal processing equipment, etc., to achieve high solder joint strength, avoid workpiece oxidation, and good fluidity

Active Publication Date: 2014-05-28
JINHUA SHUANGHUAN BRAZING ALLOYS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the silver content of the low-silver and cadmium-free silver solders disclosed in these documents is all in the range of 16.0% to 40%, and more specifically, they do not belong to the low-silver non-silver solder with a silver content of about 15% and a solder melting point close to BAg20CuZnCd. Cadmium silver solder, therefore, cannot replace BAg20CuZnCd solder "under the condition of not changing the existing production process"

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A kind of beryllium-containing low-silver and cadmium-free silver brazing filler metal is characterized in that: the composition ratio by mass percentage is: 16% Ag, 41% Cu, 1% In, 0.5% Ga, 0.0001% Be, The balance is Zn. The beryllium-containing low-silver and cadmium-free silver solder obtained by the above composition ratio has a solidus temperature of 655°C±10°C and a liquidus temperature of 745°C±10°C (both taking into account measurement errors). During brazing, the solder has good fluidity and good wetting performance to the base metal.

[0024] Use the flame brazing method, cooperate with FB102 flux, and the brazing joint strength when the brazing base material is the following combination: see the data in the brackets: copper - brass (σ b =210±25MPa, τ=200±30MPa), copper-nickel-based alloy (σ b =210±25MPa, τ=200±30MPa), brass-nickel-based alloy (σ b =330±25MPa, τ=325±30MPa), brazing joint mechanics when brazing copper-brass, copper-nickel-based alloy, brass-nic...

Embodiment 2

[0026] A beryllium-containing low-silver and cadmium-free silver solder is characterized in that: 12% Ag, 39% Cu, 8% In, 4% Ga, 0.05% Be, and the balance is Zn. The beryllium-containing low-silver and cadmium-free silver solder obtained by the above composition ratio has a solidus temperature of 655°C±10°C and a liquidus temperature of 745°C±10°C (both taking into account measurement errors). During brazing, the solder has good fluidity and good wetting performance to the base metal.

[0027] Use the flame brazing method, cooperate with FB102 flux, and the brazing joint strength when the brazing base material is the following combination: see the data in the brackets: copper - brass (σ b =210±25MPa, τ=200±30MPa), copper-nickel-based alloy (σ b =210±25MPa, τ=200±30MPa), brass-nickel-based alloy (σ b =330±25MPa, τ=325±30MPa), brazing joint mechanics when brazing copper-brass, copper-nickel-based alloy, brass-nickel-based alloy with BAg20CuZnCd solder and flux (such as FB102 fl...

Embodiment 3

[0029] A beryllium-containing low-silver and cadmium-free silver solder is characterized by: 13% Ag, 40% Cu, 2% In, 1% Ga, 0.0002% Be, and the balance is Zn. The beryllium-containing low-silver and cadmium-free silver solder obtained by the above composition ratio has a solidus temperature of 655°C±10°C and a liquidus temperature of 745°C±10°C (both taking into account measurement errors). During brazing, the solder has good fluidity and good wetting performance to the base metal.

[0030] Use the flame brazing method, cooperate with FB102 flux, and the brazing joint strength when the brazing base material is the following combination: see the data in the brackets: copper - brass (σ b =210±25MPa, τ=200±30MPa), copper-nickel-based alloy (σ b =210±25MPa, τ=200±30MPa), brass-nickel-based alloy (σ b =330±25MPa, τ=325±30MPa), brazing joint mechanics when brazing copper-brass, copper-nickel-based alloy, brass-nickel-based alloy with BAg20CuZnCd solder and flux (such as FB102 flux)...

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Abstract

The invention belongs to a metal material and specifically relates to a beryllium-containing low-silver cadmium-free silver solder. The beryllium-containing low-silver cadmium-free silver solder is characterized in that the ingredient proportion by mass percent is as follows: 12%-16% of Ag, 39%-41% of Cu, 1%-8% of In, 0.5%-4% of Ga, 0.0001%-0.05% of Be and the balance of Zn, wherein the ratio of In to Ga is equal to 2:1. The beryllium-containing low-silver cadmium-free silver solder which is obtained by adopting the ingredient proportion has the characteristics of good mobility, excellent wettability, high welding spot strength, and the like, also has a melting temperature range approaching to the melting temperature range of a BAg20CuZnCd solder, and is especially suitable for the soldering of some products in the household appliance industry and hardware industry. The problems of workpiece oxidation, reducing of the soldered joint strength, and the like, caused by ultrahigh soldering temperature, are avoided.

Description

technical field [0001] The invention belongs to the technical field of brazing materials of metal materials, and in particular relates to a beryllium-containing low-silver and cadmium-free silver solder. Background technique [0002] Among brazing materials, BAg20CuZnCd brazing filler metal, which is commonly used at present, has excellent brazing performance when combined with flux (such as FB102 flux) due to its chemical composition containing Cd element, but it cannot meet the requirements of the EU RoHS directive. Other silver solders have a variety of cadmium-free formulations, but due to their high silver content, they cannot meet the needs of market competition in the home appliance industry and hardware products industry. It is urgent to develop silver solder with a silver content of about 15% to reduce Cost of production. [0003] The applicant has searched the literature, although there are technical information on low-silver cadmium-free silver solder in the publ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/28B23K35/30
CPCB23K35/302
Inventor 蒋俊懿蒋汝智
Owner JINHUA SHUANGHUAN BRAZING ALLOYS
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