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A alloy key coincidence and its preparation method and application

A technology of alloy bonding and bonding wire, which is applied in the direction of circuits, electric solid devices, semiconductor devices, etc., can solve the problems of unsatisfactory welding effect and easy disconnection of silver alloy wires, and achieve the requirements of ball planting welding without difficulty The effect of broken wire and stable performance

Active Publication Date: 2018-02-23
浙江佳博科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The welding effect of the silver alloy welding wire described in this technical solution is not ideal, and the wire is easy to break under high-speed bonding conditions

Method used

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  • A alloy key coincidence and its preparation method and application
  • A alloy key coincidence and its preparation method and application
  • A alloy key coincidence and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The invention provides an alloy bonding wire. The composition and weight content of the alloy bonding wire are: 5wt% of 5N gold, 2wt% of aluminum, 1wt% of nickel, 91.99wt% of 5N silver, and about 0.01wt% of trace metal raw materials;

[0036] The added content of trace metal raw materials is as follows:

[0037] 5ppm≤Calcium≤20ppm

[0038] 2ppm≤rhodium≤10ppm

[0039] 20ppm≤Beryllium≤50ppm

[0040] 5ppm≤cobalt≤10ppm

[0041] 3ppm≤indium≤10ppm

[0042] 5ppm≤selenium≤10ppm.

[0043] Among them, 5N gold refers to gold with a purity of 99.999%; 5N silver refers to silver with a purity of 99.999%.

[0044] The present invention also provides a method for preparing the above-mentioned alloy bonding wire, the method comprising the following steps:

[0045] 1) Put the base material composed of silver, gold, aluminum, nickel and trace metal elements into the furnace for melting and casting to make silver alloy ingot;

[0046] The total charge is 1000g, including 5N silver ...

Embodiment 2

[0068] Alloy bonding wire of the present invention, total feeding 1000g, 5N silver material, content 90.49wt%, count 904.9g; 5N gold 8wt%, count 80g; Aluminum 1wt%, count 10g; Nickel 0.5wt%, count 5g; Metal raw material 0.01wt%, 0.1g in total; alloy addition content is as follows:

[0069] 5ppm≤Calcium≤20ppm

[0070] 2ppm≤rhodium≤10ppm

[0071] 20ppm≤Beryllium≤50ppm

[0072] 5ppm≤cobalt≤10ppm

[0073] 3ppm≤indium≤18ppm

[0074] The present invention also provides a method for preparing the above-mentioned alloy bonding wire, the method comprising the following steps:

[0075] 1) Put the base material composed of silver, gold, aluminum, nickel and trace metal elements into the furnace for melting and casting to make silver alloy ingot;

[0076] Total feed 1000g, total feed 1000g, 5N silver material, content 90.49wt%, total 904.9g; 5N gold 8wt%, total 80g; aluminum 1wt%, total 10g; nickel 0.5wt%, total 5g; add trace metal raw materials 0.01% , 0.1g in total; alloy addition...

Embodiment 3

[0092] Alloy bonding wire of the present invention, total feeding 1000g, 5N silver material, content 79.99wt%, total 799.9g; 5N gold 10wt%, total 100g; aluminum 5wt%, total 50g; nickel 5wt%, total 50g; add trace metal Raw material 0.01wt%, 0.1g in total; alloy addition content is as follows:

[0093] 5ppm≤Calcium≤10ppm

[0094] 5ppm≤rhodium≤20ppm

[0095] 20ppm≤Beryllium≤50ppm

[0096] 10ppm≤cobalt≤20ppm

[0097] 2ppm≤indium≤5ppm

[0098] The present invention also provides a method for preparing the above-mentioned alloy bonding wire, the method comprising the following steps:

[0099] 1) Put the base material composed of silver, gold, aluminum, nickel and trace metal elements into the furnace for melting and casting to make silver alloy ingot;

[0100] Total feeding 1000g, 5N silver material, content 79.99wt%, 799.9g; 5N gold 10wt%, 100g; aluminum 5wt%, 50g; nickel 5wt%, 50g; add trace metal raw material 0.01%, 0.1g; Alloy addition content is as follows:

[0101] 5ppm...

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Abstract

The invention provides an alloy bonding wire and a preparation method thereof. The composition and weight content of the alloy bonding wire are: 5-10% of gold, 1-5% of aluminum, 0.5-5% of nickel, and the rest are purity ≥ 99.999% wt% silver. The alloy bonding wire provided by the invention is low in cost, excellent in bonding performance, uninterrupted under high-speed bonding conditions, and strong in mechanical properties, and can be used for packaging of integrated circuits, large-scale integrated circuits, discrete devices, and LEDs.

Description

technical field [0001] The invention relates to an alloy bonding wire, which belongs to the technical field of packaging materials, and also relates to a preparation method and application of the alloy bonding wire. Background technique [0002] Bonding wire is the key lead material for the connection of integrated circuit or transistor chip die and lead frame. Traditional bonding wires are mainly made of pure gold. Bonding wires made of pure gold have better physical properties such as ductility and electrical conductivity. However, with the increasingly fierce competition in the LED and IC product markets, product sales prices have dropped sharply. How to develop a metal bonding wire that can achieve the effect of pure gold bonding wires and can greatly reduce material costs has become an urgent task for packaging companies. Task. [0003] Chinese patent document CN102418011A discloses a bonded gold wire, silver is added to the gold wire, and one or more of elements Ca,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C5/06C22C1/02C22F1/14H01L23/49
CPCH01L2224/45139H01L2924/12041H01L2224/45144H01L2224/45015H01L2224/43848H01L24/43H01L2224/45H01L2924/00011H01L2224/43H01L2924/01079H01L2924/01013H01L2924/01028H01L2924/01205H01L2924/0102H01L2924/01034H01L2924/01045H01L2924/01004H01L2924/01027H01L2924/01049H01L2924/00H01L2924/013H01L2924/2011H01L2924/20111H01L2924/00012H01L2924/01005
Inventor 周钢薛子夜赵义东
Owner 浙江佳博科技股份有限公司
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