Square diamond wire saw device for polycrystalline silicon ingot

Abstract

The invention discloses a diamond fretsaw device for polycrystalline silicon ingot squaring. The device comprises a diamond fretsaw used for cutting polycrystalline silicon ingots, wherein the diamond fretsaw comprises annular diamond sawing wires, at least two annular diamond sawing wires are tensioned by guide wheel sets arranged corresponding to the sawing wires respectively to operate to form a set of cutting faces parallel to one another in the X direction, at least two annular diamond sawing wires are tensioned by guide wheel sets arranged corresponding to the sawing wires respectively to operate to form another set of cutting faces parallel to one another in the Y direction, and the X-direction diamond sawing wire set and the Y-direction diamond sawing wire set on the two sets of cutting faces intersect to form a checkered cutting net. According to the device, the multiple annular diamond sawing wires are arranged to form vertical and horizontal netty lines to cut the polycrystalline silicon ingots, the single-direction, inertia-force-free, and high-velocity motion characteristics of the annular diamond sawing wires are effectively utilized, and the machining efficiency is improved by 3-5 times compared with a reciprocating type diamond fretsaw device.

Description

(1) Technical field: [0001] The invention relates to a processing device for brittle and hard non-metallic materials, in particular to a square diamond wire saw device for polycrystalline silicon ingots. (2) Background technology: [0002] After the polycrystalline silicon ingot is fired and shaped, it needs to go through processes such as square cutting and slicing to make solar photovoltaic cells. The squaring operation of the crystal ingot is the first process in the whole processing process, which is to cut the large crystal ingot into small cuboids. At present, the most mature and common squaring equipment mostly uses grid wire cutting (such as figure 1 As shown), the working area of ​​the wire saw is composed of several cutting lines perpendicular to each other and on different planes. Every four wires form a square. When the equipment is running, the cutting wire is driven to cut silicon ingots. After the cutting is completed, the wires form a square A small rectang...

AI Technical Summary

Problems solved by technology

When cutting, the diamond wire reciprocates in a short distance, the cutting efficiency is low, and it will leave scratches on the cutting surface, increasing the follow-up workload

In addition, the diamond saw wire used is relatively thin and crosses dozens of guide wheels. The reciprocating movement is likely to cause wire breakage. Once the wire is broken, it is difficult and time-consuming to change the wire.

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