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Thermosetting-resin-based heat-conductive composite material, and preparation method and application thereof

A heat-conducting composite material and thermosetting technology, which is applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of high heat-conducting network requirements, poor compatibility, complex process, etc., and achieve high-efficiency heat-conducting network, low cost, and high heat-conducting efficiency.

Active Publication Date: 2014-04-30
HUIZHOU MOREWARE INDAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, most of the currently used polymer matrices are thermoplastics, and the blending with inorganic functional fillers uses mechanical blending, which has poor compatibility and has high requirements for thermal conductivity networks.
For example, the invention patent 201110169387.X discloses a thermoplastic polymer-based thermally conductive composite material, which has a high thermal conductivity, but its thermally conductive functional filler is still as high as 30% to 40% to form a good thermally conductive network, and the process is relatively complicated. Proportionally large

Method used

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  • Thermosetting-resin-based heat-conductive composite material, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] A thermosetting resin-based thermally conductive composite material of this embodiment, the preparation method thereof comprises the following steps:

[0046] step 1.

[0047] Pretreatment of thermally conductive powder for surface modification of hollow glass microspheres: micron-sized nitrides, micron-sized carbides, micron-sized thermally conductive metal oxides, micron-sized thermally conductive carbon powders and micron-sized thermally conductive graphite The powders were irradiated and activated by a plasma activator in the normal plasma treatment mode (1.01MPa, 30°C) for more than 1h, and then mixed to form a mixture, which was dispersed uniformly by acetone ultrasonically to obtain a mixed solution; the components in the mixture Concrete description, and the consumption (parts by weight) of this component in the mixture are as follows:

[0048] The micron-scale nitride is aluminum nitride with a particle size of 1 μm to 2 μm, and the dosage is 30 parts;

[004...

Embodiment 2

[0062] A thermosetting resin-based thermally conductive composite material of this embodiment, the preparation method thereof comprises the following steps:

[0063] step 1.

[0064] Pretreatment of thermally conductive powder for surface modification of hollow glass microspheres: micron-sized nitrides, micron-sized carbides, micron-sized thermally conductive metal oxides, micron-sized thermally conductive carbon powders and micron-sized thermally conductive graphite The powders were irradiated and activated by a plasma activator in the normal plasma treatment mode (1.01MPa, 30°C) for more than 1h, and then mixed to form a mixture, which was dispersed uniformly by acetone ultrasonically to obtain a mixed solution; the components in the mixture Concrete description, and the consumption (parts by weight) of this component in the mixture are as follows:

[0065] The micron-scale nitride is aluminum nitride with a particle size of 1 μm to 2 μm, and the dosage is 30 parts;

[006...

Embodiment 3

[0079] A thermosetting resin-based thermally conductive composite material of this embodiment, the preparation method thereof comprises the following steps:

[0080] step 1.

[0081] Pretreatment of thermally conductive powder for surface modification of hollow glass microspheres: micron-sized nitrides, micron-sized carbides, micron-sized thermally conductive metal oxides, micron-sized thermally conductive carbon powders and micron-sized thermally conductive graphite The powders were irradiated and activated by a plasma activator in the normal plasma treatment mode (1.01MPa, 30°C) for more than 1h, and then mixed to form a mixture, which was dispersed uniformly by acetone ultrasonically to obtain a mixed solution; the components in the mixture Concrete description, and the consumption (parts by weight) of this component in the mixture are as follows:

[0082] The micron-scale nitride is aluminum nitride with a particle size of 1 μm to 2 μm, and the dosage is 30 parts;

[008...

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Abstract

The invention discloses a thermosetting-resin-based heat-conductive composite material, and a preparation method and application thereof. The heat-conductive composite material comprises a base body and a filling material filling the interior of the base body, wherein the base body employs thermosetting resin, and the filling material is modified hollow glass microspheres, and the surface of the hollow glass microspheres is subjected to modification processing by heat-conductive powder and is coated with the heat-conductive powder. The employed thermosetting resin is capable of well dispersing the heat-conductive powder, and the processing performance of the material is guaranteed; because of the reasonable matching of the hollow glass microspheres and the heat-conductive powder, the material has the advantages of being light, resistant to corrosion, good in heat conductivity, good in mechanical properties, free of pollution, low in cost, high in precision, long in service life and the like; and the material can be prepared into heat-radiation parts of electronic products, cooing fins of lamps, and other parts with relatively high heat-radiation requirements.

Description

[0001] technical field [0002] The invention relates to the technical field of polymer-based heat-conducting composite materials, in particular to thermosetting polymer-based heat-conducting composite materials, in particular to a thermosetting resin-based heat-conducting composite material filled with hollow glass microspheres modified on the surface of heat-conducting powder and its preparation method and apply. Background technique [0003] Thermally conductive materials are widely used in heat exchange engineering, heating engineering, electronic information and other fields. [0004] Traditional heat-conducting materials are mostly metal materials with good thermal conductivity, but due to poor corrosion resistance, high electrical conductivity, high density, and high manufacturing energy consumption of metal materials, their applications in chemical, electronic and other fields are limited. [0005] Most polymer materials have the advantages of excellent corrosion re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L77/00C08L67/06C08L23/16C08L69/00C08K13/06C08K9/12C08K9/04C08K9/02C08K9/06C08K7/28C08K3/04C08K3/22C08K3/34C08K3/28C08G59/40C08K5/098H05K7/20
Inventor 林湖彬杜崇铭李华军
Owner HUIZHOU MOREWARE INDAL
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