Halogen-free low water-absorbent thermosetting flame retardant resin composition and application thereof

Abstract

The invention discloses a halogen-free low water-absorbent thermosetting flame retardant resin composition. The composition consists of the following components in parts by weight: 25-75 parts of polycyclic benzoxazine resin, 10-50 parts of multi-functional epoxy resin, 15-25 parts of phosphorus containing phenolic resin and 0.2-20 parts of hardening agent. The halogen-free low water-absorbent thermosetting flame retardant resin composition disclosed by the invention can be prepared into a bonding sheet and a copper-clad plate; the copper-clad plate is high in heat resistance, low in expansion rate, low in dielectric dissipation factor, low in water-absorbing quality and good in processing performance, and flame retardant property can satisfy UL94-V0.

Description

technical field [0001] The invention relates to a halogen-free low water-absorbing thermosetting flame-retardant resin composition and its application, in particular to a halogen-free low water-absorbing thermosetting flame-retardant resin composition and the use of the halogen-free low water-absorbing thermosetting flame-retardant resin composition to prepare bonding sheets and copper-clad boards. Background technique [0002] With the implementation of the two "EU Directives", the European Union's "Electrical and Electronic Product Waste Directive" and "Restriction on the Use of Specific Hazardous Substances", electronic products are halogen-free and lead-free. Halogen-free and lead-free is an unavoidable problem for manufacturers. Traditional copper clad laminates use bromide as a flame retardant to achieve flame retardant effects. Studies have shown that bromide will release carcinogenic dioxins when burned, which seriously pollutes the environment and affects the environ...

AI Technical Summary

Problems solved by technology

Although the commonly used phosphorus-containing epoxy resin and nitrogen-containing phenolic resin meet most of the requirements of FR-4 copper-clad laminates for halogen-free flame retardancy, there are still some deficiencies. For example, in order to meet the requirements of UL94-V0 flame retardancy, phosphorus ( Phosphorus content 3±0.05%) content ratio, such products have defects such as high water absorption, poor heat resistance, easy moisture absorption and damp, poor heat resistance of immersion tin

For the commonly used phosphorus-containing epoxy resin series, there are defects such as high water absorption rate, poor heat resistance, easy moisture absorption, poor heat resistance of immersion tin, etc. At present, the common method is to introduce benzoxazine resin

After the benzoxazine resin is ring-opened, it can form a structure similar to phenolic resin, which can effectively reduce the water absorption rate of the cured system and improve chemical resistance, but the cured substrate has poor flexibility, high brittleness, and insufficient tin-immersion heat resistance. Defects such as poor processing performance

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