Aluminum nitride heat radiation paint for LED lamp and preparation method thereof

Abstract

The invention provides an aluminum nitride heat radiation paint for an LED lamp, wherein the paint is prepared by the following raw materials by weight: 45-48 parts of organic silicone resin, 4-6 parts of polyamide polyamine epichlorohydrin resin, 4-6 parts of trimethylhexamethylenediamine TMD, 22-24 parts of aluminum nitride, 3-5 parts of boron nitride, 2-3 parts of nano hollow bead, 1-2 parts of silica sol, 2-3 parts of tung oil, 14-17 parts of acetic ester, 7-9 parts of 2-butoxy-ethanol, 3-5 parts of phthalic polyester, 2-3 parts of isoprene, 2-3 parts of isopropanol, and 3-4 parts of film forming auxiliary agent. Aluminum nitride powder is added so as to make the paint have high heat conductive rate and good heat radiation effect; boron nitride is added so as to reinforce heat radiation effect and thermal ageing resistance; and silica sol is added so as to enhance adhesion stress of the paint, make the paint firm, and make the paint have functions of anti pollution, dust proof, aging resistance, fire proof, etc. Organic silicone resin is used as a base material to make the paint have advantages of good insulating property and excellent thermo-oxidative stability.

Description

technical field [0001] The invention belongs to the technical field of coatings, and relates to a heat dissipation coating, more specifically, an aluminum nitride heat dissipation coating for an LED lamp and a preparation method thereof. Background technique [0002] As LED technology has received widespread attention as a new generation of lighting technology in recent years, the power of LED has increased, and the heat dissipation problem has also attracted more and more attention. At present, most of the heat-conducting adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect and inconvenient operation, which are difficult to meet people's expectations. Requirements for heat dissipation of LED lamps. Some manufacturers also start to select materials with higher thermal conductivity, but this wil...

AI Technical Summary

Problems solved by technology

At present, most of the heat-conducting adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation and inconvenient operation, which are difficult to meet people's expectations. Requirements for heat dissipation of LED lamps

Some manufacturers are also starting to use materials with higher thermal conductivity, but this will increase the production cost of LEDs