Picosecond laser etching microcircuit process

Abstract

The present invention relates to the technical field of micro-circuit boards, in particular to a picosecond laser etching micro-circuit process, comprising the following steps: A, fixing the PET film whose surface is sequentially printed with a ceramic film base and a metal conductive film layer facing up on the laser engraved On the working platform of the etching machine, adjust the relative position between the laser etching machine and the working platform or the height of the laser head of the laser etching machine so that the laser focus of the laser etching machine falls directly above the substrate; B. Conductive film graphics and ceramic film graphics are exported and input into the laser engraving machine respectively, and are used as two layers; laser parameters and motion parameters are respectively set for the conductive film graphic layer and the ceramic film graphic layer; C, start the laser engraving machine and respectively etching the conductive film pattern layer and the ceramic film pattern layer of the substrate to prepare a micro circuit board. The process of the invention can meet the high-precision and high-density wiring on the surface of the micro circuit board, can complete the etching of the ceramic film and the conductive film at one time, and has low cost.

Description

technical field [0001] The invention relates to the technical field of microcircuit boards, in particular to a picosecond laser etching microcircuit technology. Background technique [0002] With the rapid development of microelectronics technology, the manufacture of printed micro circuit boards is rapidly developing in the direction of multilayer, miniaturization, functionalization and integration. Designing a large number of microholes, narrow spacing, and thin wire circuit patterns in printed microcircuit boards requires higher manufacturing technology for printed microcircuit boards. Traditional printed microcircuit board manufacturing methods include photochemical methods and templates (or wires) Screen) missing printing method is increasingly unable to meet the requirements in small batches and high-precision occasions. The main disadvantages of these processes are: many manufacturing processes, which are easy to cause large errors for high-density and high-precisio...

AI Technical Summary

Problems solved by technology

Designing a large number of microholes, narrow spacing, and thin wire circuit patterns in printed microcircuit boards requires higher manufacturing technology for printed microcircuit boards. Traditional printed microcircuit board manufacturing methods include photochemical methods and templates (or wires) Screen) missing printing method is increasingly unable to meet the requirements in small batches and high-precision occasions

The main disadvantages of these processes are: many manufacturing processes, which are easy to cause large errors for high-density and high-precision printed micro-circuit boards; many conductive materials are removed by corrosion, resulting in a large waste of precious metals; the solution used in electroplating, corrosion and other processes cause great pollution to the environment, etc.

When this limit is exceeded, during the pattern transfer process, due to the existence of the "isolating layer", the refraction and diffraction of light will cause side erosion in PCB imaging, which will seriously affect the production quality of PCB, making the minimum wire width and wire spacing restricted. impact, the quality of the manufactured product cannot be guaranteed

Moreover, on the base of the existing printed micro-circuit board, there are both ceramic film and conductive film, and both the ceramic film and the conductive film must be etched, but the current method is to process the conductive film or the ceramic film on a kind of equipment. , and then process the ceramic film or conductive film on another kind of equipment. This method is not only time-consuming and laborious, but also requires a large investment in equipment. It also requires two positioning processes. The graphics positioning is difficult and the yield is low.

In addition, the flexibility of the existing photochemical process is very low, and the production process generally must be completed by a professional manufacturer. The cycle is 3-5 days, or even two weeks, and the production cycle is long.

Moreover, once the micro circuit board is successfully produced, it cannot be modified, and it needs to be re-invested in production. For single-piece or small-batch production, the manufacturing cost is relatively high