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Embedded capacitor material as well as preparation method and application thereof

A one-sided, ceramic filler technology, applied in the direction of circuit substrate materials, chemical instruments and methods, anodic oxidation, etc., can solve problems such as difficulty and troublesome implementation, and achieve improved dielectric strength, increased dielectric constant, and excellent dielectric strength Effect

Inactive Publication Date: 2013-11-20
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method is difficult and extremely cumbersome to implement.

Method used

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  • Embedded capacitor material as well as preparation method and application thereof
  • Embedded capacitor material as well as preparation method and application thereof
  • Embedded capacitor material as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Dissolve 45g polyphenylene ether resin (hydroxyl equivalent weight 790), 55g brominated epoxy resin (epoxy resin B) and 20g phenoxy resin (C) in ethylene glycol methyl ether, and add 0.7 o-cresol novolak resin and 2-MI (2-methylimidazole) in molar ratio, and then mixed at room temperature to obtain glue. The obtained glue solution was coated on the release film, and then baked in an oven at 155°C for 5 minutes to cure to stage B, separated from the release film, and made into a thin film with a thickness of 5 μm.

[0051] Soak a 30-micron-thick aluminum sheet of type L3 in 10% sodium hydroxide solution for 20 minutes, take it out and rinse it with deionized water, then put it into an electrolytic cell containing 3% to 5% oxalic acid aqueous solution, and use the aluminum sheet As the anode and the copper plate as the cathode, the DC current density is 20A / dm 2 , with a voltage of 30V and a temperature of 40°C. After treatment for 10 minutes, take it out and rinse it wi...

Embodiment 2

[0054] Dissolve 45g polyphenylene ether resin (hydroxyl equivalent weight 790), 55g brominated epoxy resin (epoxy resin B) and 20g phenoxy resin (C) in ethylene glycol methyl ether, and add 0.7 o-cresol novolac resin and 2-MI (2-methylimidazole) in molar ratio, then add 90.5g of barium titanate with a median particle size of 10nm, and the volume percentage of barium titanate is 15%, then in Mix at room temperature to obtain a glue solution. The obtained glue solution was coated on the release film, and then baked in an oven at 155°C for 5 minutes to cure to stage B, separated from the release film, and made into a thin film with a thickness of 25 μm.

[0055] Soak a 70-micron-thick aluminum sheet in 10% sodium hydroxide solution for 20 minutes, take it out and rinse it with deionized water, then put it into an electrolytic cell containing 8% to 12% oxalic acid aqueous solution, and use the aluminum sheet as an anode , with a copper plate as the cathode, the DC current density...

Embodiment 3

[0058] Dissolve 45g of bisphenol A type epoxy resin (epoxy resin A), 55g of brominated epoxy resin (epoxy resin B) and 20g of phenoxy resin (C) in ethylene glycol methyl ether, and add relative O-cresol novolak resin and 2-MI (2-methylimidazole) with a 0.9 molar ratio of epoxy resin, and then add 342 g of barium titanate with a median particle diameter of 500 nm, and the volume percentage of barium titanate is 40%, and then mixed at room temperature to obtain a glue solution. The obtained glue solution was coated on the release film, and then baked in an oven at 155°C for 5 minutes to cure to stage B, separated from the release film, and made into a film with a thickness of 35 μm.

[0059] Soak a 100-micron-thick aluminum sheet in 10% sodium hydroxide solution for 20 minutes, take it out and rinse it with deionized water, then put it into an electrolytic cell containing 8% to 12% oxalic acid aqueous solution, and use the aluminum sheet as an anode , with a copper plate as the...

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Abstract

The invention relates to an embedded capacitor material which consists of a resin composition thin film layer and aluminum films arranged on the upper side and the lower side of the resin composition thin film layer, wherein one surface of each aluminum film contains an aluminum oxide ceramic layer; the aluminum oxide ceramic layers are in contact with the resin composition thin film layer. With the the adoption of the aluminum films with the dense aluminum oxide ceramic layers subjected to anodic oxidation, the embedded capacitor material disclosed by the invention has high dielectric intensity and a high dielectric constant and can be used for printed circuit boards.

Description

technical field [0001] The invention relates to the technical field of embedding materials, in particular to an embedding material applied to a printed circuit board, a preparation method and an application thereof. Background technique [0002] With the development of electronic devices towards high functionality and miniaturization, the proportion of passive devices in electronic systems is increasing. For example, the number of passive components in a mobile phone is 20 times that of active components. At present, passive devices are mainly surface-mounted (such as discrete capacitor devices), which occupy a large amount of space on the substrate, and there are many interconnections and soldering points on the surface, which greatly improves the electrical performance and reliability of materials and systems. reduce. In order to provide an electronic system that is lighter, better in performance, cheaper in price, and more reliable in performance, it is the only choice ...

Claims

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Application Information

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IPC IPC(8): B32B15/04B32B15/20B32B18/00B32B27/06B32B27/20B32B37/06C25D11/06H05K1/03
Inventor 殷卫峰刘潜发苏民社颜善银许永静
Owner GUANGDONG SHENGYI SCI TECH
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