High-dielectric-constant resin composition and application thereof

Abstract

The invention relates to a high-dielectric-constant resin composition, as well as a prepreg and a copper-clad laminate (CCL) which are manufactured thereby. The prepreg manufactured by the high-dielectric-constant resin composition comprises high-dielectric-constant glass fiber fabric and a high-dielectric-constant resin composition subjected to impregnation drying and then attached to the high-dielectric-constant glass fiber fabric. The CCL manufactured by the high-dielectric-constant resin composition comprises at least one overlapped prepreg and copper foils pressed and coated on both sides of the overlapped prepregs. The CCL manufactured by the high-dielectric-constant resin composition has the performances of high dielectric constant, low dielectric loss, high glass transition temperature, high peel strength and the like and can meet the performance requirement of the high-dielectric-constant antenna substrate.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a resin composition and its application, in particular to a high dielectric constant resin composition and its application, and more specifically to a high dielectric constant composite material and its use. Prepreg and copper-clad laminate, the prepreg and copper-clad laminate made of the high dielectric constant composite material can be applied to antenna substrates. Background technique [0002] With the development of emerging micro-processing technologies such as microelectronics and micro-mechanics, not only digital and baseband circuit modules, but even radio frequency modules have successfully achieved miniaturization and chip design and production. As an important RF front-end device, the antenna has increasingly stringent requirements for its indicators. Miniaturization, built-in, multi-band, and intelligent are the development trends of small antennas for m...

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Problems solved by technology

This patent uses active ester as curing agent, although the cured product has lower dielectric loss, but the glass transition temperature is lower

[0005] Chinese patent CN101974205 discloses a high dielectric constant resin composition, including epoxy resin, at least one phenolic resin or terminal carboxyl nitrile rubber, biphenyl type phenolic resin or tea type phenolic resin, high dielectric constant filler, Although the cured product has a higher dielectric constant, a higher glass transition temperature (T g up to 156°C), but the dielectric loss of the cured product is too large, as high as 0.038

[0006] In high dielectric constant copper clad laminates, in order to make the dielectric constant higher, the content of high dielectric constant fillers is very high, so that the peel strength of copper clad laminates is reduced

At the same time, in high dielectric constant copper-clad laminates, E-type glass fiber cloth is usually used as a reinforcing material, but the dielectric constant of E-type glass fiber cloth is low, and it is difficult to make high-dielectric constant copper-clad laminates The dielectric constant value reaches a higher

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