Preparation method of tapered zinc oxide/nickel oxide heterojunction diode
A technology of zinc oxide and heterojunction, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of difficulty in preparing ZnO homojunction diodes and the lack of stable preparation methods, and achieve high luminous efficiency
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[0020] 1. Form a 200nm thick NiO layer on the nickel sheet by thermal oxidation
[0021] Put the nickel sheet with a pointed surface structure into a heating furnace and heat it in the air at a heating temperature of 450 o C, heating time 45mim.
[0022] 2. Using ALD technology to prepare 80nm thick ZnO
[0023] Deposition conditions: reaction temperature 200°C, Zn(CH 2 CH 3 ) 2 (DEZ) for 1s, nitrogen purge for 1.5s, water flow for 500ms, nitrogen purge for 1s, repeat the above process 800 times.
[0024] 3. Preparation of ITO transparent upper electrode by sputtering method
[0025] ITO target is used, argon is used as sputtering gas; firstly, the background vacuum of the chamber is evacuated to 1′10 -4 Pa, argon gas is introduced, the working pressure of argon gas is 1.5Pa, the sputtering power is 60w, the sputtering time is 20min, and the electrode thickness is 100nm.
[0026] 4. Using femtosecond laser processing technology to form a pointed cone columnar structure ...
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