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Method for producing photosensitive resin and photosensitive resin composition

A technology of photosensitive resin and manufacturing method, applied in the field of photosensitive resin manufacture and photosensitive resin composition, can solve the problems of catalyst residue, increased equipment cost, substrate metal corrosion, etc., and achieves excellent PCT resistance, stable electrical characteristics, The effect of simplifying the manufacturing process

Active Publication Date: 2013-05-01
SHOWA DENKO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these photosensitive resins use catalysts such as strong acids when introducing unsaturated monocarboxylic acids, so they are highly corrosive to metals such as stainless steel, so the selection range of materials that can be used to manufacture devices is narrow, resulting in increased equipment costs.
In particular, if metal components generated by corrosion are mixed into the resin, it will have a large adverse effect on reliability as a solder resist such as electrical insulation
Moreover, when these strong acid catalysts are used, complicated catalyst removal processes such as neutralization, water washing, or adsorption treatment are required after the reaction, resulting in a large amount of waste
In particular, even if neutralization and cleaning are performed, the catalyst will remain, which will easily change the hue and acid value of the resin over time, and easily corrode the metal on the substrate
Although Patent Document 2 describes the introduction of a polymerizable unsaturated group using an unsaturated group-containing carboxylic acid ester, the esterification catalyst is also a strongly acidic compound and is not intended to solve the above-mentioned problems.

Method used

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  • Method for producing photosensitive resin and photosensitive resin composition
  • Method for producing photosensitive resin and photosensitive resin composition
  • Method for producing photosensitive resin and photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] A novolak-type cresol resin (trade name "Shonol BRG-556") manufactured by Showa High Polymer Co., Ltd. and ring 239 parts of resins having alcoholic hydroxyl groups reacted with ethylene oxide (hydroxyl groups: 239 g / eq., an average of 3.0 moles of alkylene oxide added per 1 equivalent of phenolic hydroxyl groups), 600 parts of methyl methacrylate, Zirconium tetrapentadionate (Zr(acac) 4 ) and 0.2 parts of methylhydroquinone as a polymerization inhibitor, and the reaction was carried out at 100° C. while introducing dry air (50 ml / min). After the start of the reaction, the reaction was carried out for 7 hours while distilling off the generated methanol together with methyl methacrylate from the reaction system. 30 parts of diethylene glycol monoethyl ether acetate were added, and excess methyl methacrylate and methanol were removed by vacuum distillation to obtain a methacrylic group-introduced resin solution. Furthermore, this resin was made to react with 61 parts of...

Embodiment 2

[0055] A methacrylic group-introduced resin solution was obtained in the same manner except that toluene was used instead of diethylene glycol monoethyl ether acetate in Example 1. 6 parts of acetic acid were added to the obtained solution, and it stirred at 40 degreeC for 10 minutes. Next, after washing with water three times, toluene was replaced by 30 parts of diethylene glycol monoethyl ether acetate, and distilled off to obtain a methacrylic group-introduced resin solution. Furthermore, this resin was made to react with 61 parts of tetrahydrophthalic anhydrides (0.4 equivalent with respect to alcoholic hydroxyl group), and the curable resin solution which has developability was obtained. The same evaluation as in Example 1 was performed, and the results are shown in Table 1.

Embodiment 3

[0057]In a reaction device made of SUS equipped with a stirrer, a cooling pipe, a thermometer, and an air introduction pipe, a novolak-type cresol resin (trade name "Shonol (シヨウノール) CRG-951" manufactured by Showa High Polymer Co., Ltd.) was placed. ) with propylene oxide reacted with alcoholic hydroxyl resin (hydroxyl group: 386g / eq., per 1 equivalent of phenolic hydroxyl group, an average of 5.0 moles of alkylene oxide added) 386 parts, ethyl acrylate 500 parts, bis Zinc glutarionate (Zn(acac) 2 ) and 0.3 parts of methyl hydroquinone as a polymerization inhibitor were reacted at 100° C. while introducing dry air (50 ml / min). After the reaction started, the resulting ethanol was distilled out of the reaction system together with ethyl acrylate, and reacted for 5 hours. Add 50 parts of diethylene glycol monoethyl ether acetate, carry out vacuum distillation, and remove excess ethyl acrylate and ethanol, thereby obtaining a resin solution through which acrylic acid groups have ...

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Abstract

The purpose of the present invention is to provide a method for producing a photosensitive resin that has reduced chlorinity, contains fewer metal-corroding components and the like, and is excellent in terms of required properties such as adhesiveness of the cured film, in order to achieve a highly reliable printed circuit board. The method for producing this photosensitive composition is characterized by: introducing a carboxylic acid ester (c) containing a polymerizable unsaturated group to a resin (b) having an extended chain in which some or all of the phenolic hydroxyl groups in a resin (a) having two or more phenolic hydroxyl groups per molecule are extended by a (poly) oxyalkylene group having an alcoholic hydroxyl group on an end, while in the presence of a zinc or zirconium acetylacetonate complex (d), and in the range of 0.2-0.8 equivalents of the polymerizable unsaturated group per 1 equivalent of the alcoholic hydroxyl group in the resin (b); and by reacting the remaining alcoholic hydroxyl groups with a polybasic acid anhydride (e).

Description

technical field [0001] The present invention relates to a method for producing a photosensitive resin and a photosensitive resin composition containing the resin. The method for producing the photosensitive resin is to convert the phenolic hydroxyl group of a resin having a phenolic hydroxyl group into a (poly)oxyalkylene group ( Polyoxyalkylene) is subjected to a transesterification reaction between the chain-extended resin and a carboxylic acid ester containing a polymerizable unsaturated group, and the polymerizable unsaturated group is introduced in the presence of an acetylacetone complex of zinc or zirconium, and the A method of reacting the obtained reaction product with polybasic acid anhydride. Background technique [0002] In recent years, along with the miniaturization, weight reduction, and high performance of electronic equipment on printed circuit boards, the demand for solder resist on the circuit itself used to cover the printed circuit board has gradually in...

Claims

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Application Information

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IPC IPC(8): C08G8/28C08L63/00G03F7/027
CPCH05K1/00C08L61/04G03F7/032C08L63/00G03F7/038C08K5/10C08G8/28G03F7/027
Inventor 坂本淳上井浩志小川幸志小林将行西口将司
Owner SHOWA DENKO KK
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