Infrared focal plane array detector

Abstract

The invention relates to the field of semiconductor photoelectrons, in particular to an infrared focal plane array detector which comprises an encapsulation casing, an infrared optical window and a buffering ring. The encapsulation casing, the infrared optical window and the buffering ring form a closed vacuum cavity. The buffering ring is positioned between the encapsulation casing and the infrared optical window. An electrical activation getter and an infrared focal plane detector chip are arranged in the vacuum cavity. The encapsulation casing comprises a bottom surface, wherein the infrared focal plane detector chip is arranged on the bottom surface. A welding plate is arranged on the side of the bottom surface, a metal pin is arranged outside the bottom surface, the welding plate is electrically communicated with the metal pin, and the electrical activation getter is electrically communicated with the metal pin. A metal welding plate is arranged on the infrared focal plane detector chip and connected with the welding plate through a metal wire. The encapsulation structure of the infrared focal plane array detector is simplified, the size of the infrared focal plane array detector is reduced, and the encapsulation cost of the infrared focal plane array detector is reduced.

Description

technical field [0001] The invention relates to the field of semiconductor optoelectronics, in particular to an infrared focal plane array detector. Background technique [0002] Infrared imaging technology is more and more widely used in industrial sensing, image monitoring, automobile industry, fire search and rescue, and even military navigation and night vision. Infrared focal plane detector manufacturing technology is the core of thermal imaging technology, and infrared focal plane array detector chip sealing packaging technology is the key link to realize infrared detector imaging, infrared focal plane array detector chip needs to be sealed under high vacuum environment, otherwise the imaging function of its bolometer cannot be exerted. [0003] Generally speaking, the high-vacuum packaging technology of infrared focal plane array detectors uses a metal shell as a sealed cavity, and its typical structure is as follows: figure 1 as shown, figure 2 A schematic diagra...

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Problems solved by technology

[0004] There are many internal components in this package structure, for example, it is necessary to integrate a thermoelectric cooler 5 with a volume much larger than that of the chip, so the cavity of the housing 2 is relatively large, and the outgassing rate inside the cavity is also high, requiring a larger volume The getter 7 is electrically activated, and at the same time, the opening area of ​​the shell 2 is also large, and a large optical window 6 is also required to match it, and the cost of the optical window 6 is closely related to its area. The larger the optical window 6, the higher the cost , and this kind of large-area optical window has a large deformation under different operating temperatures, and it is difficult to ensure the long-term life of the packaging structure. In short, this packaging structure makes the packaging cost high, bulky, difficult to manufacture and difficult ensure

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