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Photosensitive conductive silver electrode slurry and preparation method thereof

A technology of electrode paste and conductive silver, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve problems such as discontinuous electrodes, reduced conductivity, high temperature, etc.

Inactive Publication Date: 2013-03-13
IRICO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the occasions where sintering cannot be carried out due to the substrate or other materials that are not resistant to high temperature, only photosensitive conductive silver electrode paste can be used.
[0004] So far, most silver electrode pastes use sintering process to form electrodes, which requires higher temperature, wastes energy, and does not meet the current energy saving requirements; The method to reduce costs, adding silver-coated glass powder and other ingredients, resulting in a decrease in electrical conductivity, discontinuous electrodes, and easy power failure results

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A kind of photosensitive conductive silver electrode paste, its concrete preparation is to finish according to following process steps:

[0024] First prepare the following raw materials according to mass percentage:

[0025] Conductive silver powder: 30%, functional metal powder: 15%, adhesion promoter: 11%, photosensitive resin: 20%, solvent: 10%, curing agent: 10%, curing accelerator: 4%;

[0026] The conductive silver powder is a spherical silver powder with a purity of 99.95% and an average particle diameter of 1.5 μm.

[0027] The functional metal powder is nickel powder with an average particle size of 3 μm.

[0028] The adhesion promoter is sodium diatomate with an average particle size of 1 μm.

[0029] The photosensitive resin is trimethylolbutane triacrylate.

[0030] Described solvent is butyrolactone.

[0031] The curing agent is o-phthalyl phenyl ketone.

[0032] The curing accelerator is divinyltriamine.

[0033] The preparation method for preparing...

Embodiment 2

[0039] A kind of photosensitive conductive silver electrode paste, its concrete preparation is to finish according to following process steps:

[0040] First prepare the following raw materials according to mass percentage:

[0041] Conductive silver powder: 20%, functional metal powder: 20%, adhesion promoter: 15%, photosensitive resin: 15%, solvent: 20%, curing agent: 5%, curing accelerator: 5%;

[0042] The conductive silver powder is a spherical silver powder with a purity of 99.99% and an average particle diameter of 3 μm.

[0043] The functional metal powder is tin powder with an average particle size of 8 μm.

[0044] The adhesion promoter is sodium polymethanesulfonate with an average particle size of 3 μm.

[0045] The photosensitive resin is methacrylic acid-methyl methacrylate.

[0046] Described solvent is butyrolactone.

[0047] Described curing agent is dimethylaminobutanone.

[0048] The curing accelerator is m-phenylenediamine.

[0049] The preparation me...

Embodiment 3

[0051] A kind of photosensitive conductive silver electrode paste, its concrete preparation is to finish according to following process steps:

[0052] First prepare the following raw materials according to mass percentage:

[0053] Conductive silver powder: 40%, functional metal powder: 10%, adhesion promoter: 14%, photosensitive resin: 2%, solvent: 19%, curing agent: 10%, curing accelerator: 5%;

[0054] The conductive silver powder is a spherical silver powder with a purity of 99.95% and an average particle diameter of 2 μm.

[0055] The functional metal powder is bismuth powder with an average particle size of 5 μm.

[0056] The adhesion promoter is sodium diatomate with an average particle size of 2 μm.

[0057] The photosensitive resin is butyl dimethacrylate.

[0058] Described solvent is dibutyl phthalate.

[0059] The curing agent is hydroxyphenyl ketone.

[0060] The curing accelerator is diethylacetamide.

[0061] The preparation method is the same as in Examp...

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Abstract

The invention relates to photosensitive conductive silver electrode slurry and a preparation method thereof. The photosensitive conductive silver electrode slurry is characterized by being composed of the following components by mass: 5-25% of functional metal powder, 10-15% of adhesion promoter, 2-20% of photosensitive resin, 10-30% of solvent, 1-10% of curing agent, 1-5% of curing catalyst and the balance, conductive silver powder. The photosensitive conductive silver electrode slurry aims at resolving the problems in the using process of the silver electrode slurry in the background technology, is capable of conducting photocuring according to experiments, does not require sintering, enables electric performance of electronic components not to be affected, and is high in electrode accuracy and firm in connection. The preparation method of the photosensitive conductive silver electrode slurry is provided.

Description

technical field [0001] The invention relates to a photosensitive conductive silver electrode paste and a preparation method thereof. Background technique [0002] Conductive silver electrode paste is a kind of electrode paste, which is widely used in semiconductor integrated circuits, light-emitting diodes, plasma display panels, liquid crystal displays, organic light-emitting screens, printed circuit boards, quartz crystal resonators, light-emitting devices, stone mills, etc. In many fields such as electrodes, touch switch circuits, and electrodes of key components, the use of conductive silver electrode paste can not only ensure the connection quality of the circuit, but also improve the accuracy of the circuit connection and reduce the manufacturing cost of electronic components. [0003] The conductive silver electrode paste is generally made into a fixed shape by printing or coating the original paste, and then printed or coated on the electrode plate of the electronic ...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
Inventor 张宇阳
Owner IRICO
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