Photosensitive conductive silver electrode slurry and preparation method thereof
A technology of electrode paste and conductive silver, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve problems such as discontinuous electrodes, reduced conductivity, high temperature, etc.
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Embodiment 1
[0023] A kind of photosensitive conductive silver electrode paste, its concrete preparation is to finish according to following process steps:
[0024] First prepare the following raw materials according to mass percentage:
[0025] Conductive silver powder: 30%, functional metal powder: 15%, adhesion promoter: 11%, photosensitive resin: 20%, solvent: 10%, curing agent: 10%, curing accelerator: 4%;
[0026] The conductive silver powder is a spherical silver powder with a purity of 99.95% and an average particle diameter of 1.5 μm.
[0027] The functional metal powder is nickel powder with an average particle size of 3 μm.
[0028] The adhesion promoter is sodium diatomate with an average particle size of 1 μm.
[0029] The photosensitive resin is trimethylolbutane triacrylate.
[0030] Described solvent is butyrolactone.
[0031] The curing agent is o-phthalyl phenyl ketone.
[0032] The curing accelerator is divinyltriamine.
[0033] The preparation method for preparing...
Embodiment 2
[0039] A kind of photosensitive conductive silver electrode paste, its concrete preparation is to finish according to following process steps:
[0040] First prepare the following raw materials according to mass percentage:
[0041] Conductive silver powder: 20%, functional metal powder: 20%, adhesion promoter: 15%, photosensitive resin: 15%, solvent: 20%, curing agent: 5%, curing accelerator: 5%;
[0042] The conductive silver powder is a spherical silver powder with a purity of 99.99% and an average particle diameter of 3 μm.
[0043] The functional metal powder is tin powder with an average particle size of 8 μm.
[0044] The adhesion promoter is sodium polymethanesulfonate with an average particle size of 3 μm.
[0045] The photosensitive resin is methacrylic acid-methyl methacrylate.
[0046] Described solvent is butyrolactone.
[0047] Described curing agent is dimethylaminobutanone.
[0048] The curing accelerator is m-phenylenediamine.
[0049] The preparation me...
Embodiment 3
[0051] A kind of photosensitive conductive silver electrode paste, its concrete preparation is to finish according to following process steps:
[0052] First prepare the following raw materials according to mass percentage:
[0053] Conductive silver powder: 40%, functional metal powder: 10%, adhesion promoter: 14%, photosensitive resin: 2%, solvent: 19%, curing agent: 10%, curing accelerator: 5%;
[0054] The conductive silver powder is a spherical silver powder with a purity of 99.95% and an average particle diameter of 2 μm.
[0055] The functional metal powder is bismuth powder with an average particle size of 5 μm.
[0056] The adhesion promoter is sodium diatomate with an average particle size of 2 μm.
[0057] The photosensitive resin is butyl dimethacrylate.
[0058] Described solvent is dibutyl phthalate.
[0059] The curing agent is hydroxyphenyl ketone.
[0060] The curing accelerator is diethylacetamide.
[0061] The preparation method is the same as in Examp...
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