High-strength and high-conductivity rare-earth copper alloy and preparation method thereof

Abstract

The invention discloses a high-strength and high-conductivity rare-earth copper alloy and a preparation method of the high-strength and high-conductivity rare earth copper alloy. The high-strength and high-conductivity rare-earth copper alloy belongs to the technical field of an alloy material. Silver, phosphorus and a trace of rare-earth elements are added on the basis of a traditional Cu-Cr-Zr alloy. The copper alloy is prepared from the following components in percentage by weight: 0.2-1.0% of chrome, 0.1-0.4% of zirconium, 0.1-0.2% of silver, 0.02-0.03% of phosphorus, 0.02-0.16% of the rare-earth elements, and the balance of copper and inevitable impurity elements; the rare-earth elements are one or two or three of cerium, iridium and neodymium; a material is carried out processes such as hot forging, solid-solution treatment, cold rolling and aging treatment; prepared copper alloy has a good overall performance; tensile strength is greater than 550MPa; hardness is greater than 150HV; an elongation rate is greater than 10%; electric conductivity is greater than 80% IACS (International Annealed Copper Standard), and a softening temperature is greater than 450 DEG C. A requirement of the material for an electronic industrial field on the performance of the copper alloy can be better met; the high-strength and high-conductivity rare-earth copper alloy can be used for a lead frame material for a large-scale integrated circuit, a contact line of an electric car or an electric locomotive, an electrode alloy connector and the like.

Description

technical field [0001] The invention relates to a copper-based alloy and a preparation method thereof, in particular to a high-strength and high-conductivity rare earth copper alloy and a preparation method thereof, belonging to the technical field of alloy materials. Background technique [0002] Copper and copper alloys have been widely used in the fields of electronics, electricity, machinery and aerospace due to their good electrical and thermal conductivity and corrosion resistance, high strength and easy preparation, and are important electronic metal materials. [0003] The copper alloy material of the lead frame is one of the main components of the integrated circuit, which plays the functions of connecting and transmitting electrical signals, heat dissipation and so on. The currently developed lead frame copper-based alloys mainly include Cu-Fe-P series, Cu-Ni-Si series, Cu-Cr-Zr series, etc. Although these alloy materials can meet certain requirements, they also ha...

AI Technical Summary

Problems solved by technology

Chinese patent on May 14, 2003 (notification number: CN 1254554C) discloses a copper alloy that adds trace alloy elements La, Zn, Fe (or Co) and Ti on the basis of the traditional Cu-Cr-Zr alloy. Although the strength can reach 608.2~641.4MPa, its electrical conductivity is only 65~70%IACS, and the elongation is only ≥5%

Chinese patent on April 14, 2004 (notification number: CN 1323179C) discloses a Cu-Cr-Zr alloy, adding rare earth elements Y, La or Sm, the alloy hardness, tensile strength and softening temperature are as high as 170HBS, 750MPa and 700℃, but its elongation and conductivity are only 6% and 75%IACS

The patent (publication number: CN 101928864A) applied by Japan in my country on December 29, 2010 relates to a copper alloy that maintains electrical conductivity and stress relaxation while maintaining strength and excellent bending workability, in which Cr, Zr, Sn The contents are 0.1-0.4%, 0.02-0.2%, 0.01-0.3%, respectively, and the conductivity is above 80% IACS, but its strength is low, only 550MPa