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A kind of copper-zinc solder and preparation method thereof

A solder, copper-zinc technology, applied in the field of copper-zinc solder and its preparation, can solve the problems of copper tube rupture, stress concentration, leakage of refrigerant liquid, etc., and achieve the effects of cost reduction, easy operation and simple process

Inactive Publication Date: 2014-10-08
王志祥
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Water vaporizes under the action of high temperature, but it is inside the copper tube and cannot evaporate, so the gap between the molecules of the copper tube becomes larger, and the copper tube ruptures when a certain pressure is applied, resulting in refrigeration. liquid leak
Moreover, the hydrogen ions decomposed by ammonia gas at high temperature will also stay in the copper tube and polymerize into hydrogen molecules, causing stress concentration, exceeding the strength limit of copper, and forming small cracks inside the copper, which can also cause stress under certain pressure. Broken copper pipe

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A copper-zinc solder in this embodiment is prepared from the following raw materials in weight percentage: Cu 58%; Sn 2%; Si 0.1%; Zn 39.9%.

[0024] The production process of the copper-zinc brazing filler metal comprises the following steps: First, firstly add a zinc ingot containing 9.15% by weight of zinc to the bottom of the crucible, and then add 0.1% by weight of copper and Silicon weight percentage is 0.1% copper-silicon alloy, then add copper-containing copper-silicon weight percentage on the copper-silicon alloy and be 57.9% electrolytic copper, then add the remaining zinc ingot that contains zinc weight percentage to be 30.75% on the electrolytic copper; Then the above raw materials After adding the crucible, heat the crucible for the first time; when the crucible is heated to 1100 ° C, all the raw materials in the crucible are melted and then stop heating; then add tin ingots with a tin weight percentage of 2% in the crucible, and heat the crucible for the se...

Embodiment 2

[0027] A copper-zinc solder in this embodiment is prepared from the following raw materials in weight percentage: Cu 60.72%; Sn 1.46%; Si 0.173%; Zn 37.647%.

[0028] The production process of the copper-zinc brazing filler metal comprises the following steps: First, firstly add a zinc ingot containing 8.5% by weight of zinc to the bottom of the crucible, and then add 0.173% by weight of copper and Silicon weight percentage is 0.173% copper-silicon alloy, then add electrolytic copper containing 60.547% copper weight percentage on the copper-silicon alloy, then add the remaining zinc ingots that contain zinc weight percentage to be 29.147% on the electrolytic copper; then the above raw materials After adding the crucible, heat the crucible for the first time; when the crucible is heated to 1100 °C, all the raw materials in the crucible are melted and then stop heating; After heating to 1100 degrees, all raw materials in the crucible are melted and then stop heating; finally sti...

Embodiment 3

[0031] A copper-zinc solder in this embodiment is prepared from the following raw materials in weight percentage: Cu 58.4%; Sn 2%; Si 0.5%; Zn 39.1%.

[0032] The production process of the copper-zinc brazing filler metal comprises the following steps: First, firstly add a zinc ingot containing 9.1% by weight of zinc to the bottom of the crucible, and then add 0.5% by weight of copper and Silicon weight percent is 0.5% copper-silicon alloy, and then on the copper-silicon alloy, adding electrolytic copper containing 57.9% copper by weight, then adding the remaining zinc ingot containing 30% zinc by weight on the electrolytic copper; then the above raw materials After adding the crucible, heat the crucible for the first time; when the crucible is heated to 1100 ° C, all the raw materials in the crucible are melted and then stop heating; then add tin ingots with a tin weight percentage of 2% in the crucible, and heat the crucible for the second time. After heating to 1100 degrees...

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PUM

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Abstract

The invention discloses a copper-zinc solder and a preparation method thereof. The copper-zinc solder is prepared from the following raw materials in percentage by weight: 58 to 63 percent of Cu, 1 to 2 percent of Sn, 0.1 to 0.5 percent of Si and 34 to 41 percent of Zn. The copper-zinc solder prepared from the raw materials is low in melting point and cost, convenient to process and high in soldering performance.

Description

technical field [0001] The invention relates to a solder and a preparation method thereof, in particular to a copper-zinc solder and a preparation method thereof. Background technique [0002] The traditional copper exhaust pipe welding process generally uses Ag-based solder. Although the Ag-based brazing temperature will drop to about 850°C, smooth, beautiful, and well-wetted brazed joints can also be obtained, and the lowering of the brazing temperature can also It is an ideal solder to avoid some defects caused by the high temperature surface. But Ag-based solder is expensive and costly. By practice, gas flux is added during programmed flame Ag-based brazing. However, it is difficult to obtain satisfactory results only by using gas flux, and it must be supplemented with fluoride-containing paste or juice-like flux to obtain high-quality brazed joints. Moreover, there is generally a small amount of ammonia in the existing gas flux, which will decompose into hydrogen ion...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K35/40
Inventor 王志祥
Owner 王志祥
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