Mask conveying box and method for reducing mask pollution

A technology of mask plate and transfer box, which is applied in the field of mask plate contaminated by particles during use and transmission, mask plate transfer box, which can solve the problems of mask plate change, influence on exposure, imaging, etc., and reduce the secondary The probability of secondary pollution, the effect of improving cleanliness and reducing particle pollution

Inactive Publication Date: 2013-01-09
SHANGHAI HUALI MICROELECTRONICS CORP
View PDF8 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the mask plate is the master plate of integrated circuit exposure, it needs to achieve zero defects, and the particles larger than 45 microns falling on the surface of the mask plate will affect the exposure and may be imaged on the wafer
Once there are particles that cannot be removed, the mask plate needs to be sent back to the original factory for cleaning and re-filming, which will cause the normal wafer exposure production line to be disconnected for at least 3 to 7 days, and the characteristics of the mask plate after sending it for repair There may be changes, resulting in unstable drift of process parameters

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mask conveying box and method for reducing mask pollution
  • Mask conveying box and method for reducing mask pollution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The present invention provides a mask plate transfer box and a method for reducing mask plate pollution. In the prior art, people often cover the mask plate with a protective film so that the micro particles will not directly fall into the pattern area. There is a height difference of about 5mm between the surface of the protective film and the graphic area to reduce contamination of the mask. However, the inventor found through research that a lot of pollution particles did not fall on the mask at first, but on the inner surface of the transfer box, and fell on the surface of the mask during the transfer process, causing secondary pollution.

[0022] In view of this situation, the mask transfer box provided by the present invention is coated with an adhesive layer on the inner surface of the box cover, which can effectively capture free pollutants. On the one hand, the cleanliness of the mask transfer box itself is improved. On the one hand, it purifies the environment...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention provides a mask conveying box, a manufacturing method thereof and a method for reducing mask pollution. Adhesive layers are additionally arranged on the inner surfaces of an upper box cover and a lower box cover of the mask conveying box so as to effectively capture dissociative polluted microparticles; and the captured microparticles are difficultly to drop from the adhesive layers, so that a mask is prevented from being polluted by the microparticles on the surfaces of the conveying box, and the probability that the mask is subjected to secondary pollution is reduced.

Description

technical field [0001] The invention relates to a method for reducing contamination of a mask plate, in particular to a mask plate transfer box and a method for the mask plate to be polluted by particles during use and transmission. Background technique [0002] The integrated circuit is completed by the designer at the workstation, and the image or data about the layout is obtained, and the manufacturer (fab) needs to use the corresponding photolithography mask to transfer the layout pattern to the wafer. Pattern transfer, so the quality of the lithography mask directly affects the quality of the lithography pattern. During the chip manufacturing process, there will be dozens or even dozens of photolithography times, and each photolithography requires a mask, so the quality of each photolithography mask will affect the quality of the photolithography, so there must be a high yield , you need a high-quality mask. [0003] When the mask plate is used in the fab, because the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/66
Inventor 朱骏马兰涛严峰张旭升
Owner SHANGHAI HUALI MICROELECTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products