Metal support flexible board, metal support carrier tape for tape automated bonding using same, metal support flexible circuit board for mounting led, and copper foil-laminated metal support flexible circuit board for forming circuit

A technology that supports flexible and circuit substrates. It is used in circuit substrate materials, circuits, and printed circuits. It can solve problems such as foaming and insufficient insulation performance, and achieve the effect of easy, simple cost, and low curling.

Inactive Publication Date: 2012-12-12
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the structure in which the conductive layer exists immediately below the insulating layer, the formed circuit is arranged immediately above, so although the insulation between the circuit wiring and the insulation between each circuit wiring and the supporting metal layer can be ensured, the Insufficient insulation performance when used as a driver IC for a plasma display with a high driving voltage or a substrate for mounting an LED with a large amount of heat generation
In addition, when the copper foil for circuit formation is sequentially laminated in the customer process (customer process) such as the tape automatic bonding method, there is a possibility that the adhesive layer is sandwiched between the copper foil for circuit formation and the copper foil of the support body, Problems such as foaming in the adhesive layer due to the moisture absorption of the adhesive layer has no place to escape

Method used

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  • Metal support flexible board, metal support carrier tape for tape automated bonding using same, metal support flexible circuit board for mounting led, and copper foil-laminated metal support flexible circuit board for forming circuit
  • Metal support flexible board, metal support carrier tape for tape automated bonding using same, metal support flexible circuit board for mounting led, and copper foil-laminated metal support flexible circuit board for forming circuit
  • Metal support flexible board, metal support carrier tape for tape automated bonding using same, metal support flexible circuit board for mounting led, and copper foil-laminated metal support flexible circuit board for forming circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] (a) Preparation of adhesive layer

[0084] To 100 parts by weight of (A) dimer acid polyamide resin ("Sunmide (サンマイド)" (registered trademark) HT-100G, Air Products Japan, Inc. (エアープロダクツジャパン company), amine value 1, melt viscosity 7.0 Pa·s), 50 parts by weight of (B) phenolic resole (CKM1634 Showa Polymer Co., Ltd.), 80 parts by weight of (C) epoxy resin ("Epikote (エピコート)" (registered trademark) YL980, Japan Epoxy Resins Co., Ltd. (manufactured by J.P.S. Resins Co., Ltd.), 2 parts by weight of (D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ), manufactured by Tokyo Chemical Industry Co., Ltd.), ethanol / Toluene mixed solvent (mixing weight ratio ethanol 1: toluene 4) was stirred and mixed at 30°C to prepare an adhesive composition with a solid content concentration of 25% by weight. The adhesive composition was coated with a bar coater on (5) a protective film (a polyethylene terephthalate film with a thickness of 25 μm with a silicone release agent ("FILMBYNA" man...

Embodiment 2

[0090] Except when preparing the adhesive layer sheet, 100 parts by weight of (A) dimer acid polyamide resin ("Tohmide (トーマイド)" (registered trademark) TXC-232C, Fuji Chemicals is used as components (A) to (D) Made by Kogyo Co., Ltd., amine value 10.0, melt viscosity 24.0Pa·s), 50 parts by weight of (B) resole resin (CKM1634 made by Showa Polymer Corporation), and 80 parts by weight of (C) epoxy resin ("Epikote ( エピコート)” (registered trademark) YL980, Japan Epoxy Resins Co., Ltd. (manufactured by Japan Epoxy Resins Co., Ltd.), 2 parts by weight of (D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ)) , Tokyo Chemical Industry Co., Ltd.), the preparation was carried out in the same manner as in Example 1, and the evaluations described in (1) to (7) above were performed.

Embodiment 3

[0092] Except when preparing the adhesive layer sheet, 100 parts by weight of (A) dimer acid polyether amide resin ("Tohmide (トーマイド)" (registered trademark) PA-200, Fujifilm is used as components (A) to (D) Produced by Kasei Kogyo Co., Ltd., amine value 3, melt viscosity 40.0 Pa·s), 50 parts by weight of (B) resole resin (CKM1634, Showa Polymer Co., Ltd.), and 80 parts by weight of (C) epoxy resin ("Epikote (エピコート)" (registered trademark) YL980, Japan Epoxy Resins Co., Ltd. (manufactured by Japan Epoxy Resins Co., Ltd.), 2 parts by weight of (D) curing accelerator (2-ethyl-4-methylimidazole (2E4MZ) ), Tokyo Chemical Industry Co., Ltd.), the preparation was carried out in the same manner as in Example 1, and the evaluations described in (1) to (7) above were performed.

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PUM

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Abstract

Disclosed is a metal support flexible wiring board which has excellent wire bonding properties and low curling properties while maintaining excellent insulating properties and punching properties, and therefore can be subjected to a reel-to-reel process and facilitates packaging scheme and heat dissipation scheme. Specifically disclosed is a metal support flexible board comprising (1) an adhesive layer and (2) a support layer, wherein the support (2) is composed of a metal foil, and the adhesive layer (1) contains (A) a polyamide resin containing a dimer acid residue and (B) a phenol resin.

Description

Technical field [0001] The present invention relates to a metal supported flexible printed circuit board. More specifically, it relates to substrates for connecting semiconductor devices such as tape automatic bonding (TAB) or ball grid array (BGA, ball grid array) packaging boards used when mounting semiconductor integrated circuits (IC), and for manufacturing The flexible substrate is supported by metal for electronic components suitable for mounting substrates for LEDs or power devices. Background technique [0002] The flexible substrate is a circuit-forming substrate with excellent flexibility, which is composed of a support, an adhesive, a conductive layer for circuit formation, etc. It is also a conductive circuit layer formed by mounting target functional components, etc., through a solder resist or cover film It is widely used as a wiring board for circuit protection and various wiring guides for electronic equipment and IC mounting boards. [0003] With the popularizati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L23/14H05K1/05
CPCH01L24/86H01L23/4985H01L2924/01019H05K3/022H01L23/142H05K1/0393H01L2924/0102H01L2924/01078H01L2924/04941H01L2924/01004H01L2924/01079H01L2924/01012H05K2201/0355H01L24/50H01L2924/14H01L2924/00
Inventor 前田昭弘大野英二泽村泰司
Owner TORAY IND INC
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