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Thermally conductive pressure-sensitive adhesive composition,thermally conductive pressure-sensitive adhesive sheet,and electronic component

A technology of pressure-sensitive adhesives and thermal conductivity, applied in adhesives, electric solid devices, semiconductor devices, etc., to achieve a well-balanced effect

Inactive Publication Date: 2012-10-17
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, measures must be sought to counteract the dysfunction caused by rising temperatures

Method used

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  • Thermally conductive pressure-sensitive adhesive composition,thermally conductive pressure-sensitive adhesive sheet,and electronic component
  • Thermally conductive pressure-sensitive adhesive composition,thermally conductive pressure-sensitive adhesive sheet,and electronic component
  • Thermally conductive pressure-sensitive adhesive composition,thermally conductive pressure-sensitive adhesive sheet,and electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0212] In the reactor, add 100 parts of monomer mixture formed by 94% of 2-ethylhexyl acrylate and 6% of acrylic acid, 0.03 parts of 2,2'-azobisisobutyronitrile and 700 parts of ethyl acetate, uniformly After dissolving and nitrogen substitution, a polymerization reaction was performed at 80° C. for 6 hours. The polymerization conversion rate was 97%. The obtained polymer was dried under reduced pressure, ethyl acetate was evaporated, and a viscous solid (meth)acrylate polymer was obtained. The weight average molecular weight (Mw) of the (meth)acrylate polymer was 270,000, and the weight average molecular weight (Mw) / number average molecular weight (Mn) was 3.1. The weight average molecular weight (Mw) and the number average molecular weight (Mn) were calculated|required by standard polystyrene conversion by gel permeation chromatography using tetrahydrofuran as an eluent.

[0213] Next, 0.9 parts of polyfunctional monomers, 2-ethylhexyl acrylate (hereinafter Abbreviated as...

Embodiment 2～18、 comparative example 1～15）

[0218] As shown in Table 2 to Table 4, except for changing each compound and its amount, other experiments were carried out in the same manner as in Example 1 for thermally conductive pressure-sensitive adhesive sheets (G2) to (G19), (GC1) to (GC15) The production of heat-conductive pressure-sensitive adhesive sheets (G2)-(G19), (GC1)-(GC10), (GC13), (GC14) was obtained. For Comparative Example 11, Comparative Example 12, and Comparative Example 15, a heat-conductive pressure-sensitive-adhesive sheet could not be produced.

[0219] About the heat conductive pressure-sensitive-adhesive sheet (G1-G19, GC1), the sheet|seat of thickness 2mm, 1mm, and 0.5mm was produced, respectively, and it evaluated. About the heat conductive pressure-sensitive-adhesive sheet (GC2-GC10, GC13, GC14), the sheet|seat of thickness 2mm and 1mm was produced, respectively, and it evaluated.

[0220] In addition, the complexes not used in Example 1 are as follows.

[0221] ?Expanded graphite powder:

...

Embodiment A）

[0271] The above measurement was performed using a sheet (G1') having the same composition as the sheet (G1) of Example 1 above.

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Abstract

Disclosed are a thermally conductive pressure-sensitive adhesive sheet which has a high thermal conductivity,a good flame retardancy and a high electric breakdown strength in a well-balanced manner,a thermally conductive pressure-sensitive adhesive composition to be used as a base of said sheet,and an electronic component provided with said sheet. Specifically disclosed are:a thermally conductive pressure-sensitive adhesive composition (F) which comprises 100 parts by mass of at least one kind of a polymer (S),1.8-18 parts by mass inclusive of an expanded graphite powder (B),20-130 parts by mass inclusive of a phosphoric acid ester (C) which has a viscosity at 25oC of 3000 mPa.s or above and exists as a liquid within a temperature range of 15-100oC inclusive under atmospheric pressure,100-1000 parts by mass inclusive of alumina (E) having a BET specific surface area of 1 m2 / g or above, and 160-600 parts by mass inclusive of flame-retardant thermally conductive inorganic compound(s) (D) excluding the expanded graphite powder (B) and the alumina (E) having a BET specific surface area of 1 m2 / g or above;a thermally conductive pressure-sensitive adhesive sheet (G) comprising said thermally conductive pressure-sensitive adhesive composition (F);and an electronic component provided with said sheet.

Description

technical field [0001] The present invention relates to a heat-conductive pressure-sensitive adhesive composition, a heat-conductive pressure-sensitive adhesive sheet formed from the heat-conductive pressure-sensitive adhesive composition, and an electronic device having the sheet. Background technique [0002] In recent years, electronic devices such as plasma display panels (PDPs) and integrated circuit (IC) chips have increased their heat generation as their performance has increased. As a result, measures must be sought to counteract the dysfunction caused by the temperature rise. The method usually taken is to dissipate heat by installing radiators such as metal radiators, radiator plates, and fins on heating elements such as electronic devices. In order to conduct heat efficiently from the heating element to the radiator, various heat conducting sheets are used, and generally, a heat conductive pressure-sensitive adhesive sheet is required for fixing the heating eleme...

Claims

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Application Information

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IPC IPC(8): C09J9/00C09J7/00C09J11/04C09J11/06C09J133/04C09J201/00C09K5/08H01L23/373
CPCC09J11/02H01L23/293C08K2003/2227C08F220/06H01L23/3737C08K3/0058C08K3/04C09D133/08H01L2924/0002C09J9/00C08K5/0066C08K5/521C09K5/14C08K3/016H01L2924/00C08F220/1808C09J7/385C09J7/22C09J7/30C09J7/38C09J133/04C09J2203/326C09J2301/314C09J2301/312C09J2301/302H10K50/11
Inventor 熊本拓朗西冈亮子川村明子
Owner ZEON CORP
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