Three-beam interference lithography method and system

Abstract

The invention discloses a three-beam interference lithography method and a system. The method comprises that: a laser beam is divided into three beams by phase grating and then N times of interference exposure are realized on surface of a workpiece; a dislocation value of two adjacent exposure positions is dI / N, wherein N is an odd number greater than or equal to 3, and dI is a light intensity distribution cycle after the exposure; and the three beams are respectively a first beam, a second beam and a 0 beam with the same complex amplitude. With the three-beam interference lithography method of the invention, a large-size precision multi-level structure can be directly prepared in photoresist with high processing energy efficiency and the components used are easily obtained and have low cost. In addition, by adopting the three-beam interference exposure, the grating and the system have no zero elimination requirement and are easy to prepare.

Description

technical field [0001] The invention belongs to the field of interference lithography, and in particular relates to a three-beam interference lithography method and system. Background technique [0002] Multi-step structure is a typical and basic three-dimensional structure, which is widely used in many fields such as semiconductor, micro-optic device, micro-electromechanical system (MEMS) and flat panel display. In these applications, the requirements for the number of steps, dimensional accuracy and surface roughness of the multi-step structure are very low: the number of steps is generally 2 to 4 steps, and the accuracy of the height of the steps is required to be about a few tenths of a micron to a few microns, and the surface of the steps The roughness is required to be about a few tenths of a micron. In terms of processing methods, it can be realized by various methods such as mask lithography and laser direct writing. [0003] However, for some special application f...

AI Technical Summary

Problems solved by technology

The main disadvantages of this method are: 1. More than two steps need to be engraved multiple times, and the process is cumbersome; 2. The processing time of chemical etching is very long and the efficiency is low; 3. Chemical etching requires a vacuum environment. The volume limit, its processing format is very limited

[0014] In short, the existing processing methods cannot directly, efficiently and cost-effectively produce large-format precision multi-step structures

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