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Graphene reinforced lead-free solder and preparation method thereof

A technology of lead-free solder and graphene, which is applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems that lead-free solder has not been developed, and achieve the effect of improving performance and improving dispersibility

Active Publication Date: 2012-07-18
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a kind of lead-free solder that can completely replace traditional tin-lead solder has not been developed so far.

Method used

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  • Graphene reinforced lead-free solder and preparation method thereof
  • Graphene reinforced lead-free solder and preparation method thereof
  • Graphene reinforced lead-free solder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Put 15mg of graphene in 20ml of absolute ethanol, place the mixed solution in an ultrasonic tank for 30 minutes of ultrasonic vibration, then add the mixed solution into a ball mill, ball mill for 1 hour, take it out and dry it, and obtain a microscopic dispersion with good macroscopic density. Graphene.

[0024] Weigh 50,000 mg of Sn-Ag-Cu lead-free solder matrix powder and ball-milled graphene into a V-shaped stirrer, mix and stir for 12 hours at a speed of 50 rpm, so that the graphene is evenly distributed on the lead-free solder In the matrix.

[0025] Put the mixed powder into a mold, and uniaxially compact it into a cylinder with a diameter of 35mm at room temperature with a pressure of 180MP.

[0026] Under the protective atmosphere of high-purity argon, the cylindrical green body was sintered at 175°C and kept for 2 hours. The time for the sintering furnace to rise from room temperature to 175°C was 10 minutes. After sintering, the green body was cooled in the ...

Embodiment 2

[0031] Put 35mg of graphene in 20ml of absolute ethanol, place the mixed solution in an ultrasonic tank for 30 minutes of ultrasonic vibration, then add the mixed solution into a ball mill, ball mill for 1 hour, take it out and dry it, and get a good microscopic dispersion and macroscopic compactness of graphene.

[0032] Weigh 50,000mg of Sn-Ag-Cu lead-free solder matrix powder and ball-milled graphene into a V-shaped stirrer, mix and stir for 12 hours at a speed of 50 rpm, so that the graphene is evenly distributed on the lead-free solder In the matrix.

[0033] Put the mixed powder into a mold, and uniaxially compact it into a cylinder with a diameter of 35mm at room temperature with a pressure of 180MP.

[0034] Under the protective atmosphere of high-purity argon, the cylindrical green body was sintered at 175°C and kept for 2 hours. The time for the sintering furnace to rise from room temperature to 175°C was 10 minutes. After sintering, the green body was cooled in the...

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Abstract

The invention discloses a graphene reinforced lead-free solder, which comprises, by weight parts, graphene and lead-free solder base body of the ratio of 0.75-1.75:50000. The preparation method includes: by means of process of powder metallurgy, disposing the graphene into absolute ethyl alcohol according to proportion, vibrating ultrasonically, milling and drying the absolute ethyl alcohol with the graphene, mixing and stirring the absolute ethyl alcohol and the lead-free solder base body, pressing the same into a blank, sintering the blank at the temperature of 175 DEG C under the protective atmosphere of high-purity argon, extruding the same into a bar with the diameter of 6mm, and preparing the graphene reinforced lead-free solder. The graphene reinforced lead-free solder can meet the requirements of environmental protection and reliable welding, substitutes for conventional stannum-lead solder, has higher and more reliable mechanical performance than lead-free solder in the prior art, can be used as connection materials for oversized integrated circuits and is a composite material according with development trends of the modern electronic industry.

Description

technical field [0001] The invention relates to soldering materials, in particular to a graphene-enhanced lead-free solder and a preparation method thereof. Background technique [0002] Traditional tin-lead solder has good soldering properties and has been widely used in the electronics industry for a long time, but lead will cause potential harm to human health and the natural environment. With the development of the electronics industry, the solder joints in the VLSI are getting smaller and smaller, and the mechanical, acupuncture, and thermal loads are getting heavier and heavier, and the requirements for solder are getting higher and higher. Traditional tin-lead alloys have poor creep resistance and cannot meet the requirements of the current electronics industry. Therefore, the development and application of lead-free solders are responsible for the dual tasks of protecting the environment and improving the quality of electronic products. [0003] Typical lead-free s...

Claims

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Application Information

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IPC IPC(8): B23K35/24B23K35/40
Inventor 徐连勇刘向东韩永典荆洪阳
Owner TIANJIN UNIV
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