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High-temperature lead-free solder paste and preparation method

A technology of lead-free solder paste and lead-free tin is used in the preparation of high-temperature lead-free solder paste and the field of high-temperature lead-free solder paste. resistance, strong activity, and the effect of reducing the surface tension of metals

Active Publication Date: 2012-07-04
惠州市斯泰尔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] High-temperature lead-free solder paste is usually used in high-temperature soldering of electronic components and power modules, integrated circuits, automotive electronics, and circuit boards or integrated modules that require secondary reflow soldering, but some solder pastes choose flux to resist high temperature Poor performance, resulting in insufficient solderability, wettability, and solder joint strength. Some solder joints have many residues and are highly corrosive. Some solder joints have holes in them and the residues turn black. Delamination and faults are prone to occur, and the phenomenon of separation of tin powder and solder paste occurs

Method used

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  • High-temperature lead-free solder paste and preparation method
  • High-temperature lead-free solder paste and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Take 20g of diethylene glycol monobutyl ether, 10g of diethylene glycol octyl ether and 10g of hydroxyl-terminated polybutadiene and add them into a temperature-controlled emulsifier for heating, stir at 120°C at a speed of 200r / min for 10 minutes, and then put Add 5g of hydrogenated castor oil, 18g of polymerized rosin 604#, 9.4g of polymerized rosin 105# and 18g of special-grade hydrogenated rosin AX-E and stir for another 10 minutes at a speed of 800r / min to prepare a mixed solution and cool it down to 105°C. Add 0.8g of 2,3-dibromo-1,4-butenediol, 1.0g of sebacic acid and 5.0g of phenylsuccinic acid in sequence and stir for another 5 minutes at a speed of 1000r / min to obtain a secondary mixed solution for cooling To a temperature of 75°C, add 2.0g of polyamide wax, and then stir at a speed of 1200r / min for 5 minutes to obtain three mixed solutions; cool down to a temperature of 50°C, add 0.3g of fluorocarbon surfactant FSN100 and 0.5g of triethanolamine in sequence ...

Embodiment 2

[0028]Take 24g of diethylene glycol monobutyl ether, 14g of diethylene glycol octyl ether, and 11.9g of hydroxyl-terminated polybutadiene and add them into a temperature-controlled emulsifier for heating, stir at 125°C at a speed of 200r / min for 5 minutes, and then Add 3.0g of hydrogenated castor oil, 12g of polymerized rosin 604#, 12g of polymerized rosin 105# and 12g of special-grade hydrogenated rosin AX-E and stir for another 5 minutes at a speed of 800r / min to prepare a mixed solution and cool it down to 100°C. Add 0.3g of 2,3-dibromo-1,4-butenediol, 2.5g of sebacic acid and 3.0g of phenylsuccinic acid in sequence and stir for another 10 minutes at a speed of 1000r / min to obtain a secondary mixed solution Cool down to 70°C, add 4.0g of polyamide wax, and stir at 1200r / min for 10 minutes to prepare three mixed solutions; cool down to 55°C, add 0.3g of fluorocarbon surfactant FSN100 and 1.0g of triethanolamine in sequence Add and stir at a speed of 1200r / min for another 10 ...

Embodiment 3

[0030] Take 21.5g of diethylene glycol monobutyl ether, 12g of diethylene glycol octyl ether and 12g of hydroxyl-terminated polybutadiene and add them into a temperature-controlled emulsifier for heating, stir at 120°C at a speed of 200r / min for 10 minutes, and then Add 4.0g of hydrogenated castor oil, 15g of polymerized rosin 604#, 10g of polymerized rosin 105# and 15g of special-grade hydrogenated rosin AX-E and stir for another 10 minutes at a speed of 800r / min to prepare a primary mixed solution and cool it down to 105°C. Add 0.5g of 2,3-dibromo-1,4-butenediol, 2.0g of sebacic acid and 4.0g of phenylsuccinic acid in sequence and stir for another 5 minutes at a speed of 1000r / min to obtain a secondary mixed solution Cool down to 75°C, add 3.0g of polyamide wax, and stir at 1200r / min for 5 minutes to prepare three mixed solutions; cool down to 50°C, add 0.2g of fluorocarbon surfactant FSN100 and 0.8g of triethanolamine in sequence Add and stir at a speed of 1200r / min for ano...

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PUM

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Abstract

The invention relates to high-temperature lead-free solder paste and a preparation method. The high-temperature lead-free solder paste comprises lead-free electronic grade tin alloy powder and flux. Diethylene glycol monobutyl ether, diethylene glycol octyl ether and hydroxyl-terminated polybutadiene are added into a temperature control emulsifying machine and are heated and mixed, hydrogenated castor oil, polymerized rosin CLEARON105# and hydrogenated rosin are added into the temperature control emulsifying machine and are mixed to obtain primary mixed liquor, the primary mixed liquor is cooled, 2,3-dibromo 1,4-butylene glycol, sebacic acid and phenyl-butanedioic acid are added into the primary mixed liquor and then are mixed to obtain secondary mixed liquor, the secondary mixed liquor is cooled, polyamide wax is added into the secondary mixed liquor and then is mixed to obtain tertiary mixed liquor, the tertiary mixed liquor is cooled, fluorocarbon surfactant and triethanolamine areadded into the tertiary mixed liquor and then are mixed and vacuumized until the temperature returns to room temperature, the lead-free electronic grade tin alloy powder Sn95Sb5 is added into the prepared flux after standing at the temperature of 22-25 DEG C, and the lead-free electronic grade tin alloy powder and the flux are mixed for 15-20 minutes to obtain the high-temperature lead-free solder paste. The high-temperature lead-free solder paste has the advantages of fine solderability and wettability, high solder joint strength, high reliability and solderability in air and nitrogen protection.

Description

technical field [0001] The invention relates to a high-temperature lead-free solder paste, which is used for high-temperature welding of electronic components, power modules, integrated circuits, and automotive electronics, as well as circuit boards or integrated modules requiring secondary reflow soldering, and belongs to the field of welding materials. [0002] The invention also relates to a preparation method of the high-temperature lead-free solder paste. technical background [0003] High-temperature lead-free solder paste is usually used in high-temperature soldering of electronic components and power modules, integrated circuits, automotive electronics, and circuit boards or integrated modules that require secondary reflow soldering, but some solder pastes choose flux to resist high temperature Poor performance, resulting in insufficient solderability, wettability, and solder joint strength. Some solder joints have many residues and are highly corrosive. Some solder ...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 胡玉朱君竺周志峰
Owner 惠州市斯泰尔科技有限公司
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