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Preparation method for epoxy hardener resistant to boiling water boiling

An epoxy curing agent, epoxy compound technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problem that it is difficult to be used in the bonding occasions that are resistant to boiling water for a long time, and the bonding parts are easy to fall off, etc. problem, to achieve the effect of easy control of reaction conditions, small decrease in strength, and no discharge of three wastes

Active Publication Date: 2012-06-20
HUNAN MAGPOW ADHESIVE INDS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The curing agents used in the existing room temperature curing two-component epoxy adhesives include polyamides, aliphatic amines, aromatic amines, alicyclic amines and their modified products. Boiling in boiling water for 7 days, the adhesive parts are easy to fall off under the action of water molecules, and the strength decline rate ranges from 10 to 100%, so it is difficult to be used for long-term bonding occasions that are resistant to boiling water

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0013] Example 1 Add 20 g of m-xylylenediamine and 32 g of 3,3-dimethyl-4,4-diamino-dicyclohexylmethane into the three-necked flask, raise the temperature to 70-80°C and add 1.5 g of 2-ethyl-4-methyl Imidazole, stir and dissolve completely, then lower the temperature to 40°C, add a mixture of 28g benzyl alcohol and 15g butyl glycidyl ether dropwise, control the temperature below 60°C, and then raise the temperature to 80-100°C after 5-6 hours, and then react After cooling for 1-2 hours, the material can be discharged;

[0014] Take 2g of the curing agent and 3g of E-44 epoxy resin, mix well and prepare a sample, and measure the tensile shear strength according to GB7124-86 "Method for Determination of Tensile Shear Strength of Adhesives (Metal-Metal)";

[0015] The test results show that the tensile shear strength at room temperature is 22MPa, and the tensile shear strength after boiling in boiling water for one month is 21.7 MPa.

example 2

[0016] Example 2 Add 20 g of m-xylylenediamine and 35 g of 3,3-dimethyl-4,4-diamino-dicyclohexylmethane into a three-necked flask, raise the temperature to 70-80°C, add 2 g of 2-methylimidazole, stir and dissolve completely , then lower the temperature to 40°C, add a mixture of 24g polyethylene glycol and 13g benzyl glycidyl ether dropwise, control the temperature below 60°C, and then raise the temperature to 80-100°C after 5-6 hours, and react for 1-2 hours After cooling, the material can be discharged;

[0017] Take 2g of the curing agent and 3g of E-44 epoxy resin, mix well and prepare a sample, and measure the tensile shear strength according to GB7124-86 "Method for Determination of Tensile Shear Strength of Adhesives (Metal-Metal)";

[0018] The test results show that the tensile shear strength at room temperature is 23MPa, and the tensile shear strength after boiling in boiling water for one month is 22.3 MPa.

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Abstract

The invention relates to a preparation method for an epoxy hardener resistant to boiling water boiling. The hardener consists of an epoxy compound, a hydroxyl compound, an amine compound and an imidazole compound, wherein the epoxy compound is butyl glycidyl ether, phenmethyl glycidyl ether or 1,4-butanediol diglycidyl ether; the hydroxyl compound is phenylcarbinol, polyethylene glycol or glycerol; the amine compound is a mixture of m-xylenediamine and 3,3-dimethyl-4,4-diamino-dicyclohexyl methane; and the imidazole compound is 2-ethyl-4-methylimidazole or 2-methylimidazole. The hardener is mainly applied to occasion bonding which is resistant to a boiling water medium for a long time, and has the advantages of simple preparation process, easiness for controlling reaction conditions, environmental friendliness and small reduction rate of strength after boiling water boiling after being hardened and bonded with epoxy resin at the room temperature.

Description

technical field [0001] The invention relates to a boiling-resistant epoxy curing agent and a preparation method thereof. Background technique [0002] The curing agents used in the existing room temperature curing two-component epoxy adhesives include polyamides, aliphatic amines, aromatic amines, alicyclic amines and their modified products. Boil in boiling water for 7 days. Under the action of water molecules, the adhesive parts are easy to fall off, and the strength decline rate ranges from 10 to 100%. It is difficult to apply to the bonding occasions resistant to boiling water for a long time. Contents of the invention [0003] In order to solve the shortage of the performance of the above-mentioned adhesives, the purpose of the present invention is to provide an epoxy resin with a simple process, easy control of reaction conditions, environmental protection, and after bonding with epoxy resin at room temperature, the strength decrease rate is extremely small after boi...

Claims

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Application Information

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IPC IPC(8): C08G59/62C08G59/56C08G59/20C08G59/22C09J163/00
Inventor 袁媛李冬月
Owner HUNAN MAGPOW ADHESIVE INDS
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