High-isolation integrated circuit packaged by adopting ceramic casing

Abstract

The invention provides a high-isolation integrated circuit packaged by adopting a ceramic casing. The integrated circuit comprises a tube shell and a chip, wherein the tube shell comprises a shell bottom, a shell and a cover plate; and the chip is arranged on the shell bottom. The integrated circuit is characterized in that the shell comprises a first dielectric layer, a first metal base layer, asecond dielectric layer, a second metal base layer, a third dielectric layer and a third metal base layer which are sequentially overlapped from top to bottom; the chip is connected with the second metal base layer through a bonding wire; and the first metal base layer is connected with the third metal base layer through a first through hole. According to the integrated circuit provided by the invention, the coupling effect of a signal channel can be effectively reduced; the leakage of a local oscillator is reduced; the chip feeding frequency can be reduced; and work efficiency and economic benefit are increased; and the integrated circuit has the advantages of high isolation, simple system structure and favorable application prospect.

Description

technical field [0001] The invention relates to an integrated circuit, in particular to an integrated circuit with high isolation and packaged in a ceramic shell. Background technique [0002] In the design of RF IC, the electromagnetic field distribution of the RF signal increases with the increase of the frequency, and its spatial distribution characteristics also increase. It affects the working characteristics of the RF chip itself, and the coupled high-frequency signal energy will also cause the surrounding circuits and systems to malfunction, resulting in serious electromagnetic interference problems. [0003] The traditional ceramic shell generally has three layers, the first dielectric layer, the metal base layer and the second dielectric layer, and the metal base layer for transmitting electrical signals is between the two dielectric layers. There is no barrier layer between the signal layers that can effectively isolate the leakage of the local oscillator, resulti...

AI Technical Summary

Problems solved by technology

[0002] In the design of RF IC, the electromagnetic field distribution of the RF signal increases with the increase of the frequency, and its spatial distribution characteristics also increase. It affects the working characteristics of the RF chip itself, and the coupled high-frequency signal energy will also cause the surrounding circuits and systems to malfunction, resulting in serious electromagnetic interference problems

[0003] The traditional ceramic shell generally has three layers, the first dielectric layer, the metal base layer and the second dielectric layer, and the metal base layer for transmitting electrical signals is between the two dielectric layers. There is no barrier layer between the signal layers that can effectively isolate the leakage of the local oscillator, resulting in a high coupling effect between channels during the transmission of high-frequency signals, which will increase the leakage of the local oscillator of the signal, and the isolation is low

Images