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Conductive paste

A technology of conductive paste and conductive powder, which is applied in the field of conductive paste and can solve problems such as the possibility of solder leaching

Active Publication Date: 2012-01-25
SHOEI CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when using solder with a high melting point, the metal contained in the conductive paste as conductive powder disperses and dissolves in the molten solder, resulting in an increased possibility of a phenomenon called "solder leaching"

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0056] In the present embodiment, a plurality of samples having electrically conductive pastes having mutually different compositions were prepared, and properties and characteristics of each sample were evaluated.

[0057] (1) Sample preparation

[0058] (1.1) Preparation of glass frit

[0059] Glass raw materials were mixed so as to have the glass composition shown in Table 1 below, and each mixture was heated at a temperature of 1600° C. for 1 to 1.5 hours to melt, and the molten mixture was cast on graphite or flowed into a roll Quenching is carried out in a roll quench machine. The glass material obtained by quenching was ground for 48 hours using alumina balls using a ball mill to prepare glass frits "A" to "O" having an average particle diameter of about 2.5 μm. The average particle size is the 50% value (D 50 ). Here, the raw material of the glass frit B does not melt at a temperature of 1600° C., so the glass frit B cannot be produced. In the table below, * is in...

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Abstract

The present invention relates to a conductive paste containing: (A) conductive powders; (B) glass frits containing more than 85% the following components by weight converted by oxide and basically no lead, wherein the components comprise 16% to 47% by weight of SiO2, 33% to 52% by weight of Al2O3, 3% to 15% by weight of MgO, 15% to 45% by weight of B2O3, the ratio is the ratio in the glass frits; and (C) organic medium.

Description

technical field [0001] The present invention relates to a conductive paste which is lead-free and suitable for forming electrodes and conductors on various types of substrates, such as ceramic substrates and metal substrates, as well as electronic parts and the like by firing at high temperature. Background technique [0002] Generally, a conductive paste is formed by uniformly dispersing conductive powder including a metal such as silver, silver-palladium, copper, nickel, etc. as main components, and glass frit as an inorganic binder in In organic vehicles including resins and solvents to form pastes. Metal oxides such as bismuth oxide, copper oxide, etc. may also be added as required. [0003] The conductive paste is applied to various types of substrates and terminal portions of electronic components by various methods such as screen printing, dipping, brushing, etc. to form specific patterns. The conductive paste is then fired at a high temperature of about 700 to 950°...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/20H01B1/22
CPCY02E10/50C03C3/122C03C8/18C09D5/24H01B1/02H01B1/08H01B1/16H01B1/22H01B5/14H01B13/0026H01G4/30H01L31/042
Inventor 加藤隆新藤直人中山义德
Owner SHOEI CHEM IND CO LTD
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