Sequentially etched and plated lead frame structure without island prepacked plastic sealed material and producing method thereof
A technology of pre-filling plastic encapsulation and lead frame, applied in electrical components, electric solid devices, circuits, etc., can solve the problems of inability to use, complicated lead frame manufacturing procedures, increase in lead frame cost, etc., so as to reduce the process cost and quality cost. , the effect of reducing the risk of misalignment and reducing complexity
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[0052] The present invention relates to a baseless island pre-filled plastic encapsulant. The production method is as follows:
[0053] Step 1. Take the metal substrate
[0054] see figure 1 1. Take a metal substrate 9 with a suitable thickness. The material of the metal substrate 9 can be changed according to the functions and characteristics of the chip, such as copper, aluminum, iron, copper alloy, stainless steel or nickel-iron alloy.
[0055] Step 2, film pasting operation
[0056] see figure 2 , using a film sticking device to paste photoresist films 10 and 11 that can be exposed and developed on the front and back of the metal substrate 9, respectively, to protect the subsequent etching process, the photoresist films 10 and 11 can be dry films, It can also be wet film.
[0057] Step 3. Remove part of the photoresist film on the front and back of the metal substrate
[0058] see image 3 , using the exposure and development equipment to expose, develop and remove...
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