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A kind of diamond surface metallization method

A surface metal and diamond technology, applied in the direction of metal material coating process, coating, etc., can solve the problems of prolonging the required time, disappearing the metallization layer, increasing the thickness of the deposition layer, etc., achieving excellent brazing performance and short forming time. Effect

Inactive Publication Date: 2011-12-21
ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, because the metal solid-phase diffusion thickness is generally 0.5-10 μm, the metallization layer is thin, and it is easy to be absorbed by other elements during the sintering process, resulting in the disappearance of the metallization layer. To increase the thickness of the deposition layer, the time required will be greatly extended

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] The diamond surface metallization method described in the present invention is to clean the 45 mesh-50 mesh artificial diamond particles with acetone, put them into a glass dish, drop polyacrylate, fully mix, and then pour it into 250 mesh BNi76CrP In the solder powder, stir while breaking up the diamond particles until all the diamond particles are broken up, and a layer of solder powder is stuck on the surface, spread these diamond particles on a ceramic plate, and put them in a vacuum furnace. Vacuum to no less than 2.0×10 -2 Pa, heated to 905°C, heat preservation for 1 minute, then naturally cooled to below 50°C and released from the furnace to obtain finished diamond particles with surface metallization, and the thickness of the metallization layer can reach 0.1mm.

Embodiment 2

[0018] The diamond surface metallization method described in the present invention is to clean the 45 mesh-50 mesh artificial diamond particles with acetone, put them into a glass dish, drop polyacrylate, after fully mixing, pour it into 250 mesh Ni82CrSiBFe In the solder powder, stir while breaking up the diamond particles until all the diamond particles are dispersed and a layer of solder powder is stuck on the surface, then mix the above diamond particles into 200-mesh YG8 cemented carbide powder and mix evenly , put it into a graphite mold and press it tightly, put the mold into an argon protection furnace, heat it to 1005°C, keep it warm for 1 minute, and then naturally cool it below 50°C and release it from the furnace. The sieved diamond particles have two layers of metal on the surface The finished diamond particles of the metallized layer, the thickness of the metallized layer can reach 0.15mm.

Embodiment 3

[0020] The diamond surface metallization method described in the present invention is to clean the 50 mesh-60 mesh artificial diamond particles with acetone, put them into a glass dish, drop in the cellulose aqueous solution, and after fully mixing, pour it into 250 mesh Cu80Sn10Ti In the solder powder, stir while breaking up the diamond particles until all the diamond particles are dispersed, and a layer of solder powder is stuck on the surface, then mix these particles into 300 mesh WC powder, mix evenly, and put them into the graphite mold Press it tightly, put the mold into the vacuum furnace, and evacuate it to no less than 2.0×10 -2 Pa, heated to 905°C, kept warm for 2 minutes, then naturally cooled to below 50°C, out of the furnace, the sieved diamond particles are finished diamond particles with two metallized layers on the surface, and the thickness of the metallized layer can reach 0.2mm.

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Abstract

The invention discloses a diamond surface metallization method. The surface of the cleaned diamond particles is coated with a layer of organic adhesive, and then fully mixed with the solder, and the diamond particles adhered to the solder are screened out and dispersed in the The ceramic plate or mica plate is placed in a vacuum or inert atmosphere and heated to the melting temperature of the solder to form a solder alloy layer on the surface of the diamond particles. If the sieved diamond particles are dispersed into other metal or alloy powders, compacted and placed in a vacuum or an inert atmosphere and heated to the melting temperature of the solder, a double-layer alloy layer can be formed on the surface of the diamond particles. The advantage of the present invention is that the metallurgical bond is formed between the metallized layer and the diamond particles, the bonding force is much higher than that of mechanical wrapping, the metallized layer is formed in a short time, the thickness is large, and two layers of metallized layers of different materials can be formed at the same time without Perform secondary or tertiary treatments.

Description

technical field [0001] The invention relates to diamond particles, in particular to a diamond surface metallization method for making diamond tools. Background technique [0002] Diamond tools refer to products with a certain shape, performance and use made of diamond particles as cutting materials, with the help of binders and other auxiliary materials. Diamond tools are mainly manufactured by powder metallurgy or electroplating. Because diamond is non-metallic, it does not infiltrate with conventional metal matrix powder and solder. Mainly, the bonding strength is low, and the diamond particles are easy to fall off during use, which reduces the utilization rate of diamonds and the service life of tools. [0003] If the diamond surface has the same properties as metal, the adhesion and wettability of various metals to diamond particles will be significantly improved. Diamond surface metallization is a technology developed for this purpose. At present, there are mainly elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C24/10
Inventor 裴夤崟杨继东乔培新朱坤程亚芳邓力黄成志赵建昌张强潘世师邹伟
Owner ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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