N-type solar battery prepared by film masking process of one multi-purpose film and preparation method of N-type solar battery
A solar cell and mask technology, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of complex process and high cost of n-type solar cells, and achieve high photoelectric conversion efficiency, low cost, and easy control
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[0026] Example 1: An n-type Czochralski monocrystalline silicon wafer was selected, with a crystal plane of (100) and a doping concentration of 6Ωcm.
[0027] 1. The silicon wafer undergoes conventional surface cleaning and normal pyramid surface texture treatment;
[0028] 2. BBr3 liquid boron diffusion source to prepare P-type emitter junction 2, the diffusion temperature is 930℃, the time is 50min, and the sheet resistance is 60ohm / Sq;
[0029] 3. Use RENA's post-cleaning machine to etch away the P-type emitter junction on the back and remove the BSG at the same time;
[0030] 4. Use thermal oxidation to grow SiO2 film 4 as a mask layer with a thickness of 300nm;
[0031] 5. Etch the SiO2 film on the non-emitter surface with corrosive slurry;
[0032] 6. The surface field 3 before preparation of POCl3 liquid phosphorus diffusion source, the diffusion temperature is 850℃, the time is 40min, and the sheet resistance is 40ohm / Sq;
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