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Heat-resistant phenolic resin and application thereof in production of super-hard material resin mold

A phenolic resin, heat-resistant technology, applied in the field of 4,4-biphenol modified phenolic resin, can solve the problems of affecting the grinding efficiency and grinding ratio of abrasive tools, the decrease of cohesive force, and the shedding of abrasives, etc., to achieve good resistance Heat resistance, high softening point, good heat resistance and stability

Inactive Publication Date: 2011-08-17
HENAN UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the large amount of heat released during the grinding process, the phenolic resin decomposes or softens, the bonding force decreases, and a large amount of abrasives fall off, so that in actual grinding applications, expensive superhard materials are not completely blunted and fall off, which seriously affects The grinding efficiency and grinding ratio of the grinding tool also caused a lot of waste

Method used

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  • Heat-resistant phenolic resin and application thereof in production of super-hard material resin mold
  • Heat-resistant phenolic resin and application thereof in production of super-hard material resin mold

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Add 0.05mol (9.3g) of 4,4-biphenol, 0.86mol (70g) of 36.7% formaldehyde solution and 10mL of 20% HCl into the three-necked flask, start the stirrer, control the pH value at 1.9-2.3, and slowly raise the temperature to 80 ℃, dissolve while stirring within 30min, after the biphenol is completely dissolved, cool down to 50℃, add 0.95mol (89.3g) phenol, slowly raise the temperature to 90℃, react for 30min, then raise the temperature to 95℃ and keep boiling for about 30min, Then slowly add the remaining 20mL of 20% HCl dropwise within 30 minutes, control the reaction temperature at 105-107°C, boil and stir until the end point, vacuumize after the end point, the final temperature reaches 145°C, stop heating, quickly discharge, and cool to room temperature, Crush and sieve to get 5% heat-resistant phenolic resin powder (4,4-biphenol modified phenolic resin powder).

Embodiment 2

[0021] Add 0.2mol (39.2g) of 4,4-biphenol, 0.86mol (70g) of 36.7% formaldehyde solution and 2g of oxalic acid HCl into the three-necked flask, start the stirrer, control the pH value at 1.9-2.3, and slowly raise the temperature to 80 ℃, dissolve while stirring within 30 minutes, after the biphenol is completely dissolved, cool down to 50 ℃, add 0.80mol (75.3g) phenol, slowly raise the temperature to 90 ℃, after 30 minutes of reaction, raise the temperature to 95 ℃ and keep boiling for about 30 minutes, Then slowly add the remaining 3g of oxalic acid within 30 minutes, control the reaction temperature at 105-107°C, boil and stir until the end point, vacuumize after the end point, stop heating, discharge the material quickly, cool to room temperature, and pulverize, Sieve to get 20% heat-resistant phenolic resin powder (4,4-biphenol modified phenolic resin powder).

Embodiment 3

[0023] Add 0.05mol (9.3g) of 4,4-biphenol, 1.2mol (114.4g) of 36.7% formaldehyde solution and 10mL of 20% NaOH aqueous solution into the three-necked flask, start the stirrer, control the pH value at about 13, and slowly rise to 60°C, react for 30 minutes and then raise the temperature to 70°C. After the biphenol is completely dissolved, add 0.95mol (89.3g) phenol, react at 70°C for 30 minutes, gradually raise the temperature to 80°C and keep it for 30 minutes, then raise the temperature to 90°C and keep it for 1 hour. Until the end point, lower the temperature to below 60°C and vacuum dehydrate. After the dehydration is complete in about 30 minutes, a heat-resistant phenolic resin solution with a content of 5% (4,4-biphenol modified phenolic resin solution) is obtained.

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Abstract

The invention relates to heat-resistant phenolic resin and the application thereof in the production of a super-hard material resin mold. The heat-resistant phenolic resin is characterized in that formaldehyde, phenol and 4,4-diphenol are used as monomers, and thermoplastic phenolic resin powder or thermosetting phenolic resin solution which is prepared by reaction in the presence of an acidic catalyst or alkaline catalyst can be used for producing a super-hard material resin mold according to the traditional process. A diamond resin mold produced from a modified resin bond has the advantages of high hardness, high strength and excellent abrasion resistance.

Description

technical field [0001] The invention relates to a 4,4-biphenol modified phenolic resin, more specifically to a heat-resistant phenolic resin and its application in superhard material resin grinding tools. Background technique [0002] Phenolic resin is the earliest polymer resin synthesized and industrialized, and has been widely used in electrical appliances, casting, machinery, electronics, aviation, aerospace, military, national defense and other fields. However, phenolic resin has disadvantages such as high brittleness and high water absorption, and at the same time, the phenolic hydroxyl group and methylene in the phenolic resin structure are susceptible to high-temperature thermal oxidation degradation, which affects its heat resistance. Ordinary phenolic resin can be used stably below 200°C. If it exceeds 200°C, it will be oxidized obviously, and the thermal weight loss is high. The development of science and technology has put forward higher requirements for the app...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/24C08L61/14C08K3/04C08K3/08C08K3/22B29C43/58B24D7/02
Inventor 张琳琪彭进夏绍灵邹文俊
Owner HENAN UNIVERSITY OF TECHNOLOGY
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